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SN74AHC1G08DBVRG4

Texas Instruments

SN74AHC1G08DBVRG4 by Texas Instruments

SN74AHC1G08DBVRG4 by Texas Instruments is a CMOS logic gate with 2 inputs, 14ns propagation delay, and 3.3V nominal voltage. It is used in military-grade applications due to its Schmitt Trigger feature and operates within a temperature range of -55 to 125°C. This small outline package has a low profile design and is suitable for surface mount assembly.

Median Price

$0.410

Lifecycle Status

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17

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1k+

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Mouser Electronics

USA . 8,715 parts In-Stock

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$0.410

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$0.317

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$0.177

8,715

$0.410

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$0.317

$0.177

Distributors (In-Stock)

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DF Sales Co.

USA . 2,500 parts In-Stock

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$0.080

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DF Sales Co.

USA . 2,500 parts In-Stock

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$0.080

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Nova Conductors

Japan . 50 parts In-Stock

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Bristol Electronics

USA . 50 parts In-Stock

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Digiode

USA . 2,519 parts In-Stock

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TME

Poland . 203 parts In-Stock

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$0.670

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$0.588

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$0.367

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203

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Chip Stock

USA . 592,290 parts In-Stock

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Vyrian

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Semi Source

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Semtec, LLC

USA . 2,967 parts In-Stock

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Sunrise Surplus Inc.

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Microfarads

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ComSIT Distribution GmbH

Germany . 1,335 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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NexGen Digital

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Argo Parts USA

USA . 2,158 parts In-Stock

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$0.138

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$0.133

2,158

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$0.133

Continental Prestige Electronics

USA . 1,685 parts In-Stock

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$0.138

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$0.135

1,685

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Bastille Electronics

Australia . 27,576 parts In-Stock

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$0.138

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$0.131

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$0.125

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Corohmni

South Africa . 249 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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$0.147

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Ampacity Inc.

Singapore . 12,221 parts In-Stock

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Semicontronic

India . 12,204 parts In-Stock

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Corphita

USA . 1,587 parts In-Stock

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Parana Technologies

USA . 322 parts In-Stock

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DigiPath Technology Company

USA . 2,293 parts In-Stock

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

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ChromeModa Solutions

Germany . 7 parts In-Stock

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Perfect Parts

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Microchip USA

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GreenTree Electronics

Israel . 50 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$9.082

Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74AHC1G08DBVRG4 Logic Gate. This compact and efficient device offers fast propagation delays, high output currents, and a wide operating temperature range, making it perfect for a variety of applications in industries such as automotive, industrial, and consumer electronics. Trust in Texas Instruments to deliver top-notch performance and unmatched value with this essential component for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 14.5 ns

With a low propagation delay, this product ensures fast signal processing.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

No. of Inputs: 2

With two inputs, this logic gate can handle multiple input signals effectively.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V, this logic gate is compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient and reliable signal transmission.

Power Supplies (V): 2/5.5

With a flexible voltage range, this logic gate can be used in various applications.

No. of Terminals: 5

The five terminals provide easy connectivity to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design make this product suitable for compact electronic devices.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this logic gate can drive high-power loads.

Propagation Delay (tpd): 14 ns

The short propagation delay ensures quick response time in signal processing.

Maximum Operating Temperature: 125 °C

Operating at up to 125°C, this logic gate is suitable for high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output allows for multiple logic levels, enhancing versatility.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this logic gate can withstand cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position design allows for easy connection with other components.

Maximum Seated Height: 1.45 mm

The low seated height makes this logic gate suitable for space-constrained applications.

Width: 1.6 mm

The compact width allows for efficient placement on the PCB.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage, this logic gate can operate in low-power scenarios.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections during assembly.

Length: 2.9 mm

The small length of the package contributes to the overall space-saving design.

Temperature Grade: MILITARY

This logic gate is built to withstand rugged military environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger ensures noise immunity and signal stability.

Technology: CMOS

Built on CMOS technology, this logic gate offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form simplifies PCB mounting and soldering processes.

Packing Method: TR, 7 INCH

The Tape and Reel packing method ensures easy handling and transport during production.

Terminal Pitch: 0.95 mm

The small terminal pitch allows for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this logic gate can handle high-power applications.

Maximum Power Supply Current (ICC): 0.01 mA

With a low power supply current, this logic gate is energy-efficient.

Technical Specifications

Logic Gates SN74AHC1G08DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G08DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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