Loading...

74V2G14CTR

STMicroelectronics

74V2G14CTR by STMicroelectronics

74V2G14CTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 10.5 ns. It operates b/w 2-5.5 V and supports up to 4 A output current, making it ideal for high-speed applications in military environments. Its compact SOIC package ensures efficient space utilization on PCBs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,075

-

-

-

-

Anansix

USA . 1,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

-

-

-

-

Vyrian

USA . 528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

528

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 911 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

-

10k+ parts

$0.157

911

$0.163

-

-

$0.157

Northwest PG Solutions

USA . 113 parts In-Stock

1+ parts

$0.180

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

113

$0.180

-

-

$0.159

IDEA Electronic Components Group

UK . 1,941 parts In-Stock

1+ parts

$15.338

100+ parts

-

1k+ parts

$13.804

10k+ parts

-

1,941

$15.338

-

$13.804

-

MKK Technologies

India . 1,779 parts In-Stock

1+ parts

$28.843

100+ parts

-

1k+ parts

-

10k+ parts

-

1,779

$28.843

-

-

-

DigiPath Technology Company

USA . 1,779 parts In-Stock

1+ parts

$28.843

100+ parts

-

1k+ parts

-

10k+ parts

-

1,779

$28.843

-

-

-

Corphita

USA . 1,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

-

-

-

-

Parana Technologies

USA . 828 parts In-Stock

1+ parts

-

100+ parts

$18.339

1k+ parts

-

10k+ parts

-

828

-

$18.339

-

-

Overview

Elevate your designs with the 74V2G14CTR from STMicroelectronics, a pinnacle of quality in logic gates. This robust device combines high-speed performance with exceptional reliability, ideal for automotive and industrial applications. With its durable construction and low power consumption, it empowers engineers to innovate confidently. Trust in STMicroelectronics' industry-leading expertise to enhance your projects and deliver outstanding results every time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures good protection and reliability, making this logic gate suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay enables faster switching performance, which is crucial for high-speed digital circuits.

Surface Mount: YES

Surface mount design allows for compact circuit layouts and reduces board space, beneficial for modern electronics.

No. of Functions: 3

Multiple functions in a single package provide versatility, allowing for various logic operations without needing multiple components.

Package Shape: RECTANGULAR

The rectangular shape adds to the versatility of placements on PCBs and optimizes space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with a wide range of contemporary digital systems.

Power Supplies (V): 2/5.5

Wide power supply range allows for flexible integration into different systems with varying voltage requirements.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options, enhancing the integration capabilities with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline contribute to reduced weight and space requirements, ideal for compact devices.

Maximum I (ol): 4 Amp

A high output current rating of 4 Amps enables the handling of substantial loads, making it suitable for high-power applications.

Propagation Delay (tpd): 10.5 ns

A repeat of the low propagation delay indicates consistent performance, critical for minimizing timing issues in fast circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this component is robust enough for demanding environments and applications.

Minimum Operating Temperature: -55 °C

Operational capability at extremely low temperatures extends the usability of this logic gate in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates easier connections in multi-layered PCBs, leveling up the ease of assembly.

Maximum Seated Height: 1.1 mm

The low seated height enables tighter packing on PCBs, perfect for high-density applications.

Width: 1.25 mm

A compact width allows for more efficient alignment in crowded circuit boards, boosting the layout versatility.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage, this product is ideal for low-voltage applications, enhancing battery life in portable devices.

Length: 2 mm

A short length helps save space on PCBs, facilitating compact designs and reducing overall component footprint.

Temperature Grade: MILITARY

The military-grade rating ensures reliability and robustness for critical applications, often in extreme conditions.

Schmitt Trigger: YES

Incorporating a Schmitt trigger feature improves noise immunity and provides cleaner output signals for better performance.

Technology: CMOS

CMOS technology offers lower power consumption and higher speeds, making this logic gate suitable for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and improve connectivity, enhancing manufacturing efficiency.

Packing Method: TR

The tape and reel packing method enables automated assembly processes, speeding up production and reducing handling damage.

Terminal Pitch: 0.5 mm

A fine terminal pitch enhances the ability to integrate with high-density packaging, ideal for compact digital circuits.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a high maximum supply voltage allows the device to operate in a wider range of applications.

Technical Specifications

Logic Gates 74V2G14CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G14CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19