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74LX1G32CTR

STMicroelectronics

74LX1G32CTR by STMicroelectronics

74LX1G32CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 5.2 ns and operates at supply voltages from 1.65V to 5.5V. It features dual inputs and is ideal for compact, high-speed applications in military environments. Its small outline package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 30,000 parts In-Stock

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Semtec, LLC

USA . 17,980 parts In-Stock

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17,980

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ComSIT Distribution GmbH

Germany . 9,000 parts In-Stock

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Vyrian

USA . 2,916 parts In-Stock

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Digiode

USA . 2,469 parts In-Stock

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2,469

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Anansix

USA . 2,021 parts In-Stock

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Bristol Electronics

USA . 765 parts In-Stock

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Dan-Mar Components

USA . 765 parts In-Stock

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Microchip USA

USA . 303 parts In-Stock

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$1.565

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303

$1.565

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AZTECH Wire

Italy . 184 parts In-Stock

1+ parts

$11.160

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184

$11.160

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IDEA Electronic Components Group

UK . 766 parts In-Stock

1+ parts

$21.890

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$19.701

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766

$21.890

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$19.701

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MKK Technologies

India . 905 parts In-Stock

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$41.164

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DigiPath Technology Company

USA . 905 parts In-Stock

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$41.164

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Perfect Parts

USA . 39,025 parts In-Stock

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S.R.D Solutions

India . 24,003 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Parana Technologies

USA . 1,736 parts In-Stock

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$26.173

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Northwest PG Solutions

USA . 1,370 parts In-Stock

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Corphita

USA . 505 parts In-Stock

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Native Components

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Overview

Unlock the potential of your designs with the 74LX1G32CTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance logic gate combines exceptional reliability with ultra-fast response times, making it ideal for a variety of applications, from consumer electronics to industrial devices. With its compact, surface-mount design and robust temperature range, you can trust that your projects will thrive under demanding conditions. Experience efficiency and precision like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensuring reliability in various applications.

Propagation Delay At Nominal Supply: 5.2 ns

Fast switching speed allows for high-speed data processing.

Surface Mount: YES

Ideal for modern manufacturing processes, enhancing compact design.

No. of Inputs: 2

Versatile configuration allowing for various logic function implementations.

Package Shape: RECTANGULAR

Efficient space utilization, suitable for a wide range of PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption, making it energy-efficient for battery-operated devices.

Load Capacitance (CL): 50 pF

Supports stable and reliable performance in various circuit conditions.

Power Supplies (V): 3.3

Compatible with standard logic levels, allowing for easy integration.

No. of Terminals: 5

Compact design that simplifies PCB layout and connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact profile allows for high-density packaging on PCBs.

Maximum I (ol): 24 Amp

High output current capability suitable for driving larger loads.

Propagation Delay (tpd): 13 ns

Maintains fast response times for efficient circuit operation.

Maximum Operating Temperature: 125 °C

Wide temperature range for reliable operation in harsh environments.

Minimum Operating Temperature: -55 °C

Ensures functionality in extreme cold conditions.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance.

Terminal Position: DUAL

Offers flexibility in PCB layout and design options.

Maximum Seated Height: 1.1 mm

Low profile design helps maintain slim device dimensions.

Width: 1.25 mm

Compact width enhances compatibility with dense circuit designs.

Minimum Supply Voltage (Vsup): 1.65 V

Allows the product to operate efficiently with lower voltage levels.

Length: 2 mm

Short length contributes to space-saving in electronic assemblies.

Temperature Grade: MILITARY

Guaranteed reliability and performance in demanding applications.

Technology: CMOS

Low power consumption and high noise immunity, essential for modern logic circuits.

Terminal Form: GULL WING

Facilitates easier soldering and assembly in surface mount applications.

Packing Method: TR

Efficient packaged solution that simplifies handling and integration into production.

Terminal Pitch: 0.65 mm

Allows for tighter spacing, maximizing circuit board real estate.

Maximum Supply Voltage (Vsup): 5.5 V

Versatile power supply range for diverse circuit applications.

Technical Specifications

Logic Gates 74LX1G32CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G32CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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