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NGTB45N60S2WG

Onsemi

NGTB45N60S2WG by Onsemi

NGTB45N60S2WG by Onsemi is an N-CHANNEL IGBT with a Max VCEsat of 2.3V and Max IC of 90A. Ideal for POWER CONTROL applications, it has a Max VCE of 600V and can operate in temperatures ranging from -55 to 175 °C.

Median Price

$2.212

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,960 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.770

10k+ parts

$1.660

6,960

-

$1.980

$1.770

$1.660

DigiKey

USA . 6,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.600

10k+ parts

-

6,960

-

-

$2.600

-

Verical

USA . 6,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.212

10k+ parts

-

6,600

-

-

$2.212

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,621 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

10k+ parts

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1,621

$2.090

-

-

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Vyrian

USA . 2,437 parts In-Stock

1+ parts

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2,437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,358 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

$1.980

-

-

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$2.200

100+ parts

-

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10k+ parts

-

53

$2.200

-

-

-

Component Stockers USA

USA . 7,786 parts In-Stock

1+ parts

$2.260

100+ parts

$2.120

1k+ parts

$1.920

10k+ parts

-

7,786

$2.260

$2.120

$1.920

-

AZTECH Wire

Italy . 1,058 parts In-Stock

1+ parts

$20.200

100+ parts

-

1k+ parts

-

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-

1,058

$20.200

-

-

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Microchip USA

USA . 6,851 parts In-Stock

1+ parts

$27.235

100+ parts

-

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10k+ parts

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6,851

$27.235

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Continental Prestige Electronics

USA . 6,960 parts In-Stock

1+ parts

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100+ parts

$3.070

1k+ parts

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10k+ parts

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6,960

-

$3.070

-

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A-Z Elektronik GmbH

Germany . 5,883 parts In-Stock

1+ parts

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100+ parts

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5,883

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Problanco Electronics

Mexico . 5,735 parts In-Stock

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5,735

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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SupplyDigital Components

Austria . 1,843 parts In-Stock

1+ parts

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1,843

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UHIMA Technologies

Türkiye . 775 parts In-Stock

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775

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Kulean Microsystems

USA . 519 parts In-Stock

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519

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TANS Electronics

Latvia . 56 parts In-Stock

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56

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 28 parts In-Stock

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28

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Overview

Elevate your power control solutions with the NGTB45N60S2WG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors for various applications. With a built-in diode and N-channel configuration, this transistor offers reliable performance and efficiency. Experience the benefits of its 300W maximum power dissipation and quick turn-off time of 232ns. Whether you're working on industrial machinery or renewable energy systems, this transistor is designed to meet your needs. Upgrade your projects today with the NGTB45N60S2WG and unlock the full potential of your power control applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient freewheeling, reducing losses and improving overall performance.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in high-power circuits.

Maximum VCEsat: 2.3 V

Low VCEsat means reduced power losses and improved efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and compact design, suitable for various installation requirements.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during assembly.

Nominal Turn Off Time (toff): 232 ns

Fast turn-off time ensures quick switching and minimal switching losses, enhancing overall efficiency.

No. of Terminals: 3

Simple 3-terminal configuration for easy integration into circuits and systems.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability allows for handling of large power levels without risk of overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure and stable mounting options for various applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures usability in different environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating allows for safe operation in high-voltage circuits.

Transistor Element Material: SILICON

Silicon material offers high reliability and performance for power switching applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating provides robustness and protection against voltage spikes.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in harsh environmental conditions.

Maximum Collector Current (IC): 90 A

High collector current rating enables handling of large current levels in power circuits.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage for efficient switching and control of the IGBT.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and enhances electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB45N60S2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

232 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NGTB45N60S2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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