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NGTB30N120IHLWG

Onsemi

NGTB30N120IHLWG by Onsemi

NGTB30N120IHLWG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 60A IC, and 260W power dissipation. Ideal for high-power applications requiring efficient switching at up to 150 °C operating temperature.

Median Price

$87.910

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 10 parts In-Stock

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$87.910

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Digiode

USA . 588 parts In-Stock

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$83.514

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Vyrian

USA . 5,436 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 54 parts In-Stock

1+ parts

$2.109

100+ parts

$1.919

1k+ parts

$1.729

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54

$2.109

$1.919

$1.729

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AZTECH Wire

Italy . 941 parts In-Stock

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$13.020

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Corphita

USA . 1,431 parts In-Stock

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$79.119

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Corohmni

South Africa . 247 parts In-Stock

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Component Stockers USA

USA . 422 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,086 parts In-Stock

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Problanco Electronics

Mexico . 3,213 parts In-Stock

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SupplyDigital Components

Austria . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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Kulean Microsystems

USA . 275 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 10 parts In-Stock

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Overview

Unleash the power of innovation with the NGTB30N120IHLWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that redefine performance standards. Whether you're in automotive, industrial, or renewable energy sectors, this N-CHANNEL IGBT offers unmatched reliability and efficiency. Elevate your projects with the NGTB30N120IHLWG and experience the ultimate value it brings to your applications.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and faster switching speeds compared to P-CHANNEL IGBTs, making them ideal for high power applications.

Maximum Power Dissipation (Abs): 260 W

The high maximum power dissipation allows for efficient operation and handling of high power levels, making this IGBT suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures without compromising performance, ensuring reliability in harsh environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating allows for use in applications with high voltage requirements, providing robust voltage handling capabilities.

Maximum Gate-Emitter Voltage: 20 V

The moderate maximum gate-emitter voltage rating allows for precise control over the switching characteristics of the IGBT, ensuring stable and reliable operation.

Maximum Collector Current (IC): 60 A

With a high maximum collector current rating, this IGBT can handle high current levels, making it suitable for power electronics applications that require large current capabilities.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The moderate gate-emitter threshold voltage ensures that the IGBT switches on and off correctly, minimizing power losses and improving efficiency in power applications.

Terminal Finish: TIN

The TIN terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity in various operating conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N120IHLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB30N120IHLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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