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NGTB25N120FLWG

Onsemi

NGTB25N120FLWG by Onsemi

NGTB25N120FLWG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 50A IC, and 192W power dissipation. Ideal for high-power applications requiring efficient switching at up to 150 °C operating temperature.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 90 parts In-Stock

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-

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$2.380

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$2.130

10k+ parts

$2.010

90

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$2.380

$2.130

$2.010

Distributors (In-Stock)

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Digiode

USA . 696 parts In-Stock

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$2.518

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696

$2.518

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Chip Stock

USA . 9,550 parts In-Stock

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Vyrian

USA . 5,507 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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Corphita

USA . 741 parts In-Stock

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$2.385

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741

$2.385

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Corohmni

South Africa . 434 parts In-Stock

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$2.650

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AZTECH Wire

Italy . 429 parts In-Stock

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$8.710

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429

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QUARKTWIN TECHNOLOGY LTD

USA . 12,121 parts In-Stock

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SupplyDigital Components

Austria . 7,479 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 5,849 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,592 parts In-Stock

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Kulean Microsystems

USA . 3,296 parts In-Stock

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Problanco Electronics

Mexico . 1,927 parts In-Stock

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Futuretech Components

Singapore . 658 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 402 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Experience the superior quality and performance of the NGTB25N120FLWG by Onsemi, a leading manufacturer in the industry. This N-CHANNEL Insulated Gate Bipolar Transistor (IGBT) offers unmatched reliability and efficiency for a wide range of applications. With a maximum power dissipation of 192W and a collector-emitter voltage of 1200V, this product ensures optimal functionality even in the most demanding environments. Trust Onsemi to deliver exceptional value and benefits with every purchase, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses compared to P-CHANNEL IGBTs, making them more efficient for high power applications.

Maximum Power Dissipation (Abs): 192 W

With a high maximum power dissipation, this IGBT can handle large amounts of power without overheating, ensuring reliability in demanding environments.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this IGBT to operate in extreme conditions without sacrificing performance.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can be used in high voltage circuits and applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20V ensures safe and reliable operation of the IGBT within specified limits.

Maximum Collector Current (IC): 50 A

The high maximum collector current allows this IGBT to handle large currents, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5V ensures efficient switching of the IGBT, reducing power loss and improving overall performance.

Terminal Finish: TIN

TIN terminal finish provides good solderability and ensures reliable connections in electronic circuits, contributing to the overall quality of the product.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB25N120FLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB25N120FLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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