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NGTB15N60EG

Onsemi

NGTB15N60EG by Onsemi

NGTB15N60EG by Onsemi is an N-CHANNEL IGBT with 117W power dissipation, 600V collector-emitter voltage, and 30A collector current. It operates up to 150 °C and has a gate-emitter threshold voltage of 6.5V. Ideal for high-power applications in various industries like automotive and industrial equipment.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Arrow

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Digiode

USA . 776 parts In-Stock

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Vyrian

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Corphita

USA . 1,976 parts In-Stock

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Corohmni

South Africa . 322 parts In-Stock

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Advanced Electronics

New Zealand . 124 parts In-Stock

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$1.352

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$1.230

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AZTECH Wire

Italy . 57 parts In-Stock

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Kulean Microsystems

USA . 6,442 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 4,410 parts In-Stock

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SupplyDigital Components

Austria . 4,037 parts In-Stock

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Perfect Parts

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NGTB15N60EG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that are designed to exceed expectations. This N-CHANNEL transistor offers a maximum power dissipation of 117 W and can handle up to 30 A of collector current. Perfect for a wide range of applications, this transistor is versatile and reliable. Experience the value and benefits of this product firsthand and take your projects to the next level with the NGTB15N60EG by Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high power handling capabilities, making them suitable for high-power applications.

Maximum Power Dissipation (Abs): 117 W

With a high maximum power dissipation, this IGBT can handle significant power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for operation in harsh environments without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating of 600V allows for handling of high voltage applications with ease.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20V ensures reliable and stable control of the IGBT, resulting in efficient operation.

Maximum Collector Current (IC): 30 A

With a maximum collector current rating of 30A, this IGBT is capable of handling high current loads, making it suitable for power electronics applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5V ensures precise control over the IGBT's switching characteristics, resulting in efficient operation.

Terminal Finish: TIN

The TIN terminal finish provides a reliable and durable connection, ensuring long-term performance and stability of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB15N60EG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB15N60EG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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