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MUN5211DW1T1G

Onsemi

MUN5211DW1T1G by Onsemi

MUN5211DW1T1G by Onsemi is a NPN BJT transistor with 2 elements and built-in resistor, ideal for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 35. This small outline package with gull wing terminals operates up to 150°C, making it suitable for various electronic devices.

Median Price

$0.060

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 71,319 parts In-Stock

1+ parts

$0.240

100+ parts

$0.092

1k+ parts

$0.059

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$0.045

71,319

$0.240

$0.092

$0.059

$0.045

DigiKey

USA . 13,247 parts In-Stock

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Newark

USA . 7,659 parts In-Stock

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EBV Elektronik

Germany . 2,652,000 parts In-Stock

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Avnet

USA . 1,935,000 parts In-Stock

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Arrow

USA . 213,000 parts In-Stock

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Verical

USA . 213,000 parts In-Stock

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Future Electronics

Canada . 135,000 parts In-Stock

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Rochester

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 1,557 parts In-Stock

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Farnell

UK . 1,130 parts In-Stock

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Element14

Singapore . 1,130 parts In-Stock

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Flip Electronics (Authorized)

USA . 783 parts In-Stock

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Digiode

USA . 172 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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TME

Poland . 23,555 parts In-Stock

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Bristol Electronics

USA . 4,097 parts In-Stock

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Maritex

Poland . 5,704 parts In-Stock

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$0.046

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NAC Semi

USA . 1,524,000 parts In-Stock

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IBS Electronics

USA . 456,000 parts In-Stock

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Sensible Micro Corp

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Vyrian

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Cyclops Electronics Ltd

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Zilex Electronics Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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Microfarads

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Rebound Electronics

UK . 1,201 parts In-Stock

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Flip Electronics

USA . 783 parts In-Stock

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LWI Electronics Inc

India . 190 parts In-Stock

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NPI Materials, Inc.

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Semicontronic

India . 139,048 parts In-Stock

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Corohmni

South Africa . 165 parts In-Stock

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Ampacity Inc.

Singapore . 136,216 parts In-Stock

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Corphita

USA . 154 parts In-Stock

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Argo Parts USA

USA . 3,076 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 22,798 parts In-Stock

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Aztec Data Supply Inc.

USA . 75 parts In-Stock

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Perfect Parts

USA . 8,024,389 parts In-Stock

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GreenTree Electronics

Israel . 1,164,000 parts In-Stock

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Authorized Procurement Solutions

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RC Electronics

USA . 112,647 parts In-Stock

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Infinite Electronics LLP (Excess)

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Glotronic Ltd.

UK . 91,129 parts In-Stock

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Kepictronics

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Eastek

USA . 24,000 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Lixinc

USA . 9,138 parts In-Stock

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TANS Electronics

Latvia . 3,827 parts In-Stock

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Kulean Microsystems

USA . 3,818 parts In-Stock

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SupplyDigital Components

Austria . 2,993 parts In-Stock

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Computer Components Inc. - USA

USA . 2,935 parts In-Stock

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Problanco Electronics

Mexico . 216 parts In-Stock

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UHIMA Technologies

Türkiye . 78 parts In-Stock

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Overview

Upgrade your electronics with the MUN5211DW1T1G from Onsemi! This high-quality Small Signal Bipolar Junction Transistor (BJT) boasts a durable plastic/epoxy package and NPN configuration, making it perfect for switching applications. With built-in resistors and a compact rectangular shape, this transistor offers convenience and efficiency. Trust in Onsemi's reputation for excellence and reliability to bring you top-notch performance every time. Don't settle for less when you can have the best - choose the MUN5211DW1T1G for all your electronic needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this transistor versatile in its applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Having built-in resistors simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can rapidly turn on and off, making it ideal for digital circuits.

Surface Mount: YES

Being surface mountable allows for easy automated assembly, reducing manufacturing costs and increasing efficiency.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to place on the PCB and reduces wasted space.

No. of Elements: 2

Having 2 elements increases the versatility of the transistor in circuit design.

Maximum Power Dissipation (Abs): 0.15 W

With a maximum power dissipation of 0.15W, this transistor can handle high power loads.

Minimum DC Current Gain (hFE): 35

A minimum DC current gain of 35 ensures reliable amplification in various circuit configurations.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments.

Maximum Collector-Emitter Voltage: 50 V

The high collector-emitter voltage rating of 50V provides flexibility in circuit design for various applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability compared to other materials.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1A, this transistor can handle moderate current levels.

Terminal Finish: MATTE TIN

Matte tin finish prevents oxidation and ensures good electrical contact for reliable performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in PCB layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, making it suitable for automated soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can be reliably soldered onto the PCB without damage.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5211DW1T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5211DW1T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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