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MUN5314DW1T1G

Onsemi

MUN5314DW1T1G by Onsemi

MUN5314DW1T1G by Onsemi is a Small Signal BJT with NPN and PNP types. It features 2 elements with built-in resistor, suitable for switching applications. With a max collector-emitter voltage of 50V and max current of 0.1A, it operates at up to 150°C peak reflow temperature.

Median Price

$0.079

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 41,497 parts In-Stock

1+ parts

$0.260

100+ parts

$0.100

1k+ parts

$0.065

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$0.050

41,497

$0.260

$0.100

$0.065

$0.050

DigiKey

USA . 8,760 parts In-Stock

1+ parts

$0.260

100+ parts

$0.100

1k+ parts

$0.064

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8,760

$0.260

$0.100

$0.064

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Flip Electronics (Authorized)

USA . 2,250,234 parts In-Stock

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Newark

USA . 198,000 parts In-Stock

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$0.068

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$0.068

Avnet

USA . 6,000 parts In-Stock

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$0.026

6,000

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Rochester

USA . 3,152 parts In-Stock

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$0.038

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$0.032

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$0.028

3,152

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$0.038

$0.032

$0.028

Arrow

USA . 1,695 parts In-Stock

1+ parts

-

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$0.090

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$0.058

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$0.041

1,695

-

$0.090

$0.058

$0.041

Chip1Stop

Japan . 1,695 parts In-Stock

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-

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$0.049

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$0.029

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$0.026

1,695

-

$0.049

$0.029

$0.026

Verical

USA . 1,695 parts In-Stock

1+ parts

-

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$0.090

1k+ parts

$0.058

10k+ parts

$0.041

1,695

-

$0.090

$0.058

$0.041

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,489 parts In-Stock

1+ parts

$0.010

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1,489

$0.010

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Nova Conductors

Japan . 15 parts In-Stock

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$0.051

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15

$0.051

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Bristol Electronics

USA . 1,718 parts In-Stock

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$0.164

100+ parts

$0.082

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$0.033

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1,718

$0.164

$0.082

$0.033

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TME

Poland . 1,697 parts In-Stock

1+ parts

$0.230

100+ parts

$0.087

1k+ parts

$0.054

10k+ parts

$0.037

1,697

$0.230

$0.087

$0.054

$0.037

NAC Semi

USA . 1,896,000 parts In-Stock

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$0.044

1,896,000

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Flip Electronics

USA . 872,929 parts In-Stock

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872,929

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Vyrian

USA . 287,655 parts In-Stock

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287,655

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Chip Stock

USA . 34,000 parts In-Stock

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34,000

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IBS Electronics

USA . 15,000 parts In-Stock

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$0.043

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$0.043

Diverse Electronics

Canada . 3,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,424 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,718 parts In-Stock

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Dan-Mar Components

USA . 1,718 parts In-Stock

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NPI Materials, Inc.

USA . 48 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 287,415 parts In-Stock

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$0.009

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287,415

$0.009

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Semicontronic

India . 286,990 parts In-Stock

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$0.009

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286,990

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Corphita

USA . 1,542 parts In-Stock

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Corohmni

South Africa . 320 parts In-Stock

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320

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Continental Prestige Electronics

USA . 4,774 parts In-Stock

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Argo Parts USA

USA . 1,291 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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100

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Modulus Dynamics

Lithuania . 20,638 parts In-Stock

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$0.644

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$0.644

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$0.644

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20,638

$0.644

$0.644

$0.644

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Aztec Data Supply Inc.

USA . 4,005 parts In-Stock

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$1.838

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4,005

$1.838

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Authorized Procurement Solutions

USA . 888,000 parts In-Stock

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Kepictronics

USA . 360,000 parts In-Stock

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Eastek

USA . 189,000 parts In-Stock

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RC Electronics

USA . 43,200 parts In-Stock

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$0.060

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GreenTree Electronics

Israel . 39,000 parts In-Stock

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Perfect Parts

USA . 34,023 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,839 parts In-Stock

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Glotronic Ltd.

UK . 24,000 parts In-Stock

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Problanco Electronics

Mexico . 3,935 parts In-Stock

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Lixinc

USA . 3,572 parts In-Stock

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Kulean Microsystems

USA . 2,356 parts In-Stock

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SupplyDigital Components

Austria . 1,495 parts In-Stock

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Metaverse IC Inc.

Canada . 1,089 parts In-Stock

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UHIMA Technologies

Türkiye . 675 parts In-Stock

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675

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TANS Electronics

Latvia . 88 parts In-Stock

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Overview

Enhance your electronic projects with the MUN5314DW1T1G by Onsemi, a top-of-the-line Small Signal Bipolar Junction Transistor (BJT) designed for switching applications. With Onsemi's renowned quality and expertise in semiconductor manufacturing, this transistor offers unparalleled performance and reliability. Its unique configuration of separate NPN and PNP elements with built-in resistors provides added convenience and flexibility. Whether you're a hobbyist or a professional, this surface-mount transistor is a must-have for your toolkit. Experience the value and benefits of the MUN5314DW1T1G and take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package ensures durability and reliability, making it suitable for various applications.

Polarity or Channel Type: NPN AND PNP

Having both NPN and PNP types allows for flexibility in circuit design and compatibility with different requirements.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space, making this transistor ideal for compact applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient switching performance.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving assembly time and space.

Package Shape: RECTANGULAR

Rectangular shape fits well with modern PCB layouts and makes it easier to place and solder the transistor.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection to the PCB, reducing the risk of electrical issues.

Maximum Power Dissipation (Abs): 0.15 W

With a maximum power dissipation of 0.15W, this transistor can handle moderate power loads, suitable for a range of applications.

Minimum DC Current Gain (hFE): 80

A minimum DC current gain of 80 ensures consistent and reliable amplification in various circuit configurations.

Maximum Operating Temperature: 150 °C

The ability to operate at up to 150°C ensures reliability in high-temperature environments.

Maximum Collector-Emitter Voltage: 50 V

A maximum collector-emitter voltage of 50V allows for versatile use in various voltage applications.

Transistor Element Material: SILICON

Silicon material provides good performance and reliability, making it a preferred choice for many electronic applications.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1A, this transistor can handle moderate current loads with ease.

Terminal Finish: MATTE TIN

Matte tin finish on terminals ensures good solderability and reliable connections for long-term performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in board layout and allow for easy integration into various circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for up to 30 seconds ensures reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the transistor can be easily soldered using standard reflow processes.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5314DW1T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO 4.7

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5314DW1T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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