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MUN5112T1G

Onsemi

MUN5112T1G by Onsemi

MUN5112T1G by Onsemi is a PNP BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, collector current of 0.1A, and DC current gain of 60. This small outline package with gull wing terminals operates up to 150°C, making it suitable for various electronic devices.

Median Price

$0.032

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,000 parts In-Stock

1+ parts

$0.074

100+ parts

$0.027

1k+ parts

$0.026

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$0.024

9,000

$0.074

$0.027

$0.026

$0.024

Mouser Electronics

USA . 11,390 parts In-Stock

1+ parts

$0.170

100+ parts

$0.063

1k+ parts

$0.040

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$0.030

11,390

$0.170

$0.063

$0.040

$0.030

EBV Elektronik

Germany . 150,000 parts In-Stock

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Avnet

USA . 81,000 parts In-Stock

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Newark

USA . 45,000 parts In-Stock

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$0.032

45,000

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$0.032

Chip1Stop

Japan . 36,000 parts In-Stock

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$0.038

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$0.029

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$0.017

36,000

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$0.038

$0.029

$0.017

DigiKey

USA . 13,801 parts In-Stock

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$0.027

13,801

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$0.027

Verical

USA . 9,000 parts In-Stock

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$0.026

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$0.024

9,000

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$0.026

$0.024

Flip Electronics (Authorized)

USA . 2,900 parts In-Stock

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2,900

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Rochester

USA . 800 parts In-Stock

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$0.020

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$0.017

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$0.015

800

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$0.020

$0.017

$0.015

Distributors (In-Stock)

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Digiode

USA . 1,257 parts In-Stock

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$0.024

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Vyrian

USA . 151,639 parts In-Stock

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151,639

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NAC Semi

USA . 120,000 parts In-Stock

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$0.056

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$0.056

Zilex Electronics Inc.

Canada . 30,000 parts In-Stock

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Chip Stock

USA . 26,000 parts In-Stock

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Flip Electronics

USA . 2,900 parts In-Stock

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2,900

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Semicontronic

India . 153,426 parts In-Stock

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$0.021

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$0.020

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153,426

$0.021

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Ampacity Inc.

Singapore . 153,235 parts In-Stock

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$0.021

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153,235

$0.021

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Corphita

USA . 324 parts In-Stock

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$0.022

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324

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Corohmni

South Africa . 66 parts In-Stock

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$0.025

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66

$0.025

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Aztec Data Supply Inc.

USA . 3,455 parts In-Stock

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$0.563

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$0.563

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Continental Prestige Electronics

USA . 467,900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,082 parts In-Stock

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Perfect Parts

USA . 21,050 parts In-Stock

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RC Electronics

USA . 12,000 parts In-Stock

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Metaverse IC Inc.

Canada . 9,000 parts In-Stock

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Kulean Microsystems

USA . 7,522 parts In-Stock

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SupplyDigital Components

Austria . 6,417 parts In-Stock

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Problanco Electronics

Mexico . 4,880 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,759 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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TANS Electronics

Latvia . 184 parts In-Stock

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Bastille Electronics

Australia . 54 parts In-Stock

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Overview

The MUN5112T1G by Onsemi is a top-quality Small Signal Bipolar Junction Transistor with PNP polarity, perfect for switching applications. With a single configuration and built-in resistor, this transistor offers exceptional performance and reliability. Its compact rectangular package with gull wing terminals makes it easy to install, while the maximum operating temperature of 150°C ensures durability. Trust Onsemi's reputation for excellence and choose the MUN5112T1G for your next project, where efficiency and precision are key.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for small signal transistors, offering good durability and heat resistance.

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-side switching applications, making this transistor suitable for various switching tasks.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can quickly turn on and off for efficient control of current flow.

Surface Mount: YES

Surface mount transistors are easier to assemble on PCBs and save space compared to through-hole components.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB and easy integration into compact electronic devices.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mount installation and provide reliable connections.

No. of Terminals: 3

Three terminals allow for easy connection in a circuit and provide versatility in circuit design.

Maximum Power Dissipation (Abs): 0.31 W

With a maximum power dissipation of 0.31W, this transistor can handle moderate power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in space-saving on the PCB and allows for dense circuit designs.

Minimum DC Current Gain (hFE): 60

A minimum hFE of 60 ensures consistent and reliable amplification of current in the transistor.

Maximum Operating Temperature: 150 °C

Operational up to 150°C, making it suitable for a wide range of temperature environments.

Maximum Collector-Emitter Voltage: 50 V

With a maximum voltage rating of 50V, this transistor can handle typical voltage levels encountered in many applications.

Transistor Element Material: SILICON

Silicon material offers good performance characteristics for small signal transistors, ensuring reliability and stability.

Maximum Collector Current (IC): 0.1 A

Capable of handling a maximum collector current of 0.1A, suitable for low to moderate power applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability for surface mount assembly and ensures reliable connections.

Terminal Position: DUAL

Dual terminal position facilitates easy mounting on the PCB and provides stable connections.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this transistor can withstand typical reflow soldering processes.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of up to 260°C, ensuring reliable solder joints during assembly.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5112T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

60

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5112T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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