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MUN5113T3G

Onsemi

MUN5113T3G by Onsemi

MUN5113T3G by Onsemi is a PNP BJT transistor with built-in resistor for switching applications. It has a max VCEsat of 0.25V, min hFE of 80, and can handle a max IC of 0.1A. With surface mount capability and operating temperatures ranging from -55 to 150°C, it is ideal for compact electronic designs requiring efficient power management.

Median Price

$0.021

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 209,850 parts In-Stock

1+ parts

-

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$0.021

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$0.018

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$0.016

209,850

-

$0.021

$0.018

$0.016

Verical

USA . 150,000 parts In-Stock

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150,000

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DigiKey

USA . 60,000 parts In-Stock

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60,000

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Flip Electronics (Authorized)

USA . 60,000 parts In-Stock

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Mouser Electronics

USA . 16,954 parts In-Stock

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$0.021

16,954

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$0.021

Distributors (In-Stock)

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Vyrian

USA . 487 parts In-Stock

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$0.021

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487

$0.021

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Digiode

USA . 1,184 parts In-Stock

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$0.024

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1,184

$0.024

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Flip Electronics

USA . 60,000 parts In-Stock

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60,000

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Chip Stock

USA . 60,000 parts In-Stock

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60,000

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Distributors (Availability)

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Corohmni

South Africa . 262 parts In-Stock

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$0.021

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262

$0.021

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Corphita

USA . 193 parts In-Stock

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$0.022

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193

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Continental Prestige Electronics

USA . 209,850 parts In-Stock

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$0.018

209,850

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$0.018

Perfect Parts

USA . 78,400 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,423 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,747 parts In-Stock

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2,747

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Kulean Microsystems

USA . 2,713 parts In-Stock

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TANS Electronics

Latvia . 2,585 parts In-Stock

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2,585

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SupplyDigital Components

Austria . 1,847 parts In-Stock

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1,847

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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721

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Overview

Upgrade your electronic devices with the MUN5113T3G by Onsemi, a high-quality Small Signal Bipolar Junction Transistor (BJT) that offers exceptional performance in switching applications. With a built-in resistor and low VCEsat of 0.25V, this PNP transistor provides reliable and efficient operation. Its compact design and surface-mount capability make it ideal for a wide range of applications. Trust in Onsemi's reputation for excellence in semiconductor manufacturing and invest in the MUN5113T3G for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the transistor lightweight and durable, suitable for diverse applications.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into circuits and enhances the switching functionality of the transistor.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space, making this transistor convenient and efficient for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast response times and efficient operation in switching circuits.

Surface Mount: YES

The surface mount capability simplifies PCB assembly processes, making it easier to integrate the transistor into electronic devices.

Maximum VCEsat: 0.25 V

With a low maximum VCEsat value, this transistor offers efficient performance with minimal voltage drop, ensuring high energy efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on a circuit board, optimizing space utilization and enhancing overall design flexibility.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures reliable electrical connections, contributing to the overall durability and performance of the transistor.

No. of Terminals: 3

With three terminals, this transistor offers versatility in circuit configurations and applications, providing flexibility and compatibility in various electronic designs.

Maximum Power Dissipation (Abs): 0.202 W

The maximum power dissipation value of 0.202 W indicates the transistor's ability to handle power efficiently, ensuring reliable operation and performance under different load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and designs where size is a critical factor.

Minimum DC Current Gain (hFE): 80

The minimum DC current gain of 80 ensures consistent and reliable amplification of input signals, making this transistor suitable for various amplification applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to operate efficiently in temperature-intensive environments, ensuring reliable performance under challenging conditions.

Maximum Collector-Emitter Voltage: 50 V

With a maximum collector-emitter voltage of 50 V, this transistor can withstand higher voltage levels, making it suitable for applications requiring higher voltage handling capabilities.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance, reliability, and versatility, making it a suitable choice for a wide range of electronic applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the transistor to function effectively in cold environments, enhancing its usability in various temperature conditions.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1 A, this transistor can handle moderate current levels, making it suitable for low to medium current applications where efficient switching is required.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and performance in various operating conditions.

Terminal Position: DUAL

The dual terminal position allows for easy integration into circuit designs and provides flexibility in connection options, making this transistor versatile and user-friendly.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5113T3G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum VCEsat:

.25 V

Trade Compliance

MUN5113T3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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