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MUN5211T1G

Onsemi

MUN5211T1G by Onsemi

MUN5211T1G by Onsemi is a NPN BJT with built-in resistor for switching applications. Features include hFE of 35, VCE of 50V, and IC of 0.1A. Its small outline package with Gull Wing terminals makes it suitable for surface mount designs in various electronic circuits.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 13,829 parts In-Stock

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$0.146

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DigiKey

USA . 70,045 parts In-Stock

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$0.170

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$0.063

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$0.040

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70,045

$0.170

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Mouser Electronics

USA . 1,411 parts In-Stock

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$0.200

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$0.069

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$0.043

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$0.038

1,411

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$0.069

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$0.038

Newark

USA . 405,000 parts In-Stock

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Arrow

USA . 390,000 parts In-Stock

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Verical

USA . 390,000 parts In-Stock

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EBV Elektronik

Germany . 204,000 parts In-Stock

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Master Electronics

USA . 93,000 parts In-Stock

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Farnell

UK . 42,260 parts In-Stock

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$0.059

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$0.038

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$0.033

42,260

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$0.038

$0.033

Element14

Singapore . 42,260 parts In-Stock

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$0.100

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$0.056

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$0.055

42,260

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$0.100

$0.056

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Rochester

USA . 36,000 parts In-Stock

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$0.030

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$0.025

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$0.023

36,000

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$0.030

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RS (Exports)

UK . 20,500 parts In-Stock

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Digiode

USA . 170 parts In-Stock

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$0.024

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170

$0.024

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Nova Conductors

Japan . 10 parts In-Stock

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$0.041

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10

$0.041

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TME

Poland . 1,274 parts In-Stock

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$0.100

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$0.047

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$0.034

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$0.024

1,274

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$0.047

$0.034

$0.024

Maritex

Poland . 2,305 parts In-Stock

1+ parts

$0.302

100+ parts

$0.077

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$0.050

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$0.044

2,305

$0.302

$0.077

$0.050

$0.044

IBS Electronics

USA . 691,000 parts In-Stock

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Chip Stock

USA . 295,500 parts In-Stock

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NAC Semi

USA . 168,000 parts In-Stock

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Vyrian

USA . 85,642 parts In-Stock

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R&J Components

USA . 72,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 24,885 parts In-Stock

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Bristol Electronics

USA . 21,997 parts In-Stock

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Sea View Technologies

USA . 18,997 parts In-Stock

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Rebound Electronics

UK . 16,320 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Inventory MP

USA . 3,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,991 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,851 parts In-Stock

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Semi Source

USA . 1,977 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,780 parts In-Stock

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Pegasus Components GmbH

Germany . 150 parts In-Stock

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Sensible Micro Corp

USA . 22 parts In-Stock

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22

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Distributors (Availability)

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Semicontronic

India . 143,540 parts In-Stock

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$0.014

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$0.014

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$0.014

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143,540

$0.014

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$0.014

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Ampacity Inc.

Singapore . 87,907 parts In-Stock

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$0.014

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Corohmni

South Africa . 123 parts In-Stock

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$0.016

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Corphita

USA . 704 parts In-Stock

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$0.022

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704

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Aranea Global

USA . 2,000 parts In-Stock

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$0.040

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$0.039

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$0.040

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Argo Parts USA

USA . 3,801 parts In-Stock

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$0.041

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3,801

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Continental Prestige Electronics

USA . 59,720 parts In-Stock

1+ parts

$0.168

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$0.079

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$0.030

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59,720

$0.168

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Aztec Data Supply Inc.

USA . 2,842 parts In-Stock

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$1.038

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Perfect Parts

USA . 1,915,116 parts In-Stock

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GreenTree Electronics

Israel . 1,116,000 parts In-Stock

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Eastek

USA . 912,000 parts In-Stock

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Authorized Procurement Solutions

USA . 275,000 parts In-Stock

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Component Stockers USA

USA . 30,128 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,865 parts In-Stock

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Formix International (Excess)

India . 9,727 parts In-Stock

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TANS Electronics

Latvia . 8,082 parts In-Stock

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Problanco Electronics

Mexico . 7,103 parts In-Stock

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Kepictronics

USA . 5,800 parts In-Stock

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Kulean Microsystems

USA . 3,356 parts In-Stock

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SupplyDigital Components

Austria . 1,908 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,780 parts In-Stock

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Assy Fe

Spain . 1,768 parts In-Stock

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Glotronic Ltd.

UK . 1,424 parts In-Stock

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Lixinc

USA . 614 parts In-Stock

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614

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Overview

Looking for a reliable solution for your switching applications? Look no further than the MUN5211T1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance with this NPN transistor. With a single configuration and built-in resistor, this small signal BJT offers exceptional value and benefits. Its compact size, high power dissipation, and temperature resistance make it ideal for a wide range of electronic devices. Trust Onsemi to deliver the quality and reliability you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications.

Configuration: SINGLE WITH BUILT-IN RESISTOR

Simplifies circuit design by integrating a resistor within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing reliable performance in such scenarios.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and resources.

Maximum Power Dissipation (Abs): 0.31 W

Can handle moderate power dissipation, suitable for various operating conditions.

Package Style (Meter): SMALL OUTLINE

Compact package size saves space on the PCB and allows for dense circuit layouts.

Maximum Collector-Emitter Voltage: 50 V

Suitable for applications requiring higher voltage capabilities.

Maximum Collector Current (IC): 0.1 A

With a current rating of 0.1A, it can handle moderate current levels.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5211T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5211T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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