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MUN5214T1G

Onsemi

MUN5214T1G by Onsemi

MUN5214T1G by Onsemi is a NPN BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 80. This small outline package with gull wing terminals operates up to 150°C, making it ideal for surface mount applications.

Median Price

$0.044

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 7,494 parts In-Stock

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$0.165

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Mouser Electronics

USA . 31,298 parts In-Stock

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DigiKey

USA . 1,349 parts In-Stock

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Arrow

USA . 54,000 parts In-Stock

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Verical

USA . 45,000 parts In-Stock

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Master Electronics

USA . 45,000 parts In-Stock

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Avnet

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RS (Exports)

UK . 23,700 parts In-Stock

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Rochester

USA . 9,000 parts In-Stock

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Chip1Stop

Japan . 2,690 parts In-Stock

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Element14

Singapore . 113 parts In-Stock

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Farnell

UK . 75 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,468 parts In-Stock

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$0.005

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Nova Conductors

Japan . 50 parts In-Stock

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NAC Semi

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Sternenhof Electronics

Switzerland . 122,953 parts In-Stock

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Vyrian

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Chip Stock

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Lantek

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ComSIT Distribution GmbH

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Speed Components Ltd

Israel . 2,820 parts In-Stock

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Cyclops Electronics Ltd

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Elcom Components

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 62,696 parts In-Stock

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$0.004

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Semicontronic

India . 49,061 parts In-Stock

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Corphita

USA . 293 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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Component Stockers USA

USA . 67,704 parts In-Stock

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Argo Parts USA

USA . 1,635 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 5,205 parts In-Stock

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$0.177

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$0.085

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$0.034

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Aztec Data Supply Inc.

USA . 3,985 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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RC Electronics

USA . 139,393 parts In-Stock

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Epart123

USA . 120,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,467 parts In-Stock

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TANS Electronics

Latvia . 4,426 parts In-Stock

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SupplyDigital Components

Austria . 2,336 parts In-Stock

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Kepictronics

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Kulean Microsystems

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UHIMA Technologies

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Futuretech Components

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Problanco Electronics

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Authorized Procurement Solutions

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Overview

Enhance your electronic projects with the MUN5214T1G by Onsemi, a high-quality Small Signal Bipolar Junction Transistor. Manufactured by Onsemi, a trusted name in semiconductor technology, this NPN transistor is ideal for switching applications. With a built-in resistor and a compact rectangular package, this transistor offers convenience and efficiency in circuit design. Trust Onsemi's reputation for reliability and performance, and experience the value and benefits of this versatile component in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: NPN

Allows for easy integration into NPN transistor circuits.

Configuration: SINGLE WITH BUILT-IN RESISTOR

Saves space and simplifies circuit design by having a built-in resistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing reliable performance in switching circuits.

Surface Mount: YES

Easily mountable on circuit boards, making it convenient for production and assembly.

Package Shape: RECTANGULAR

Standard shape for easy handling and integration into circuit designs.

No. of Terminals: 3

Simple and straightforward connection with only 3 terminals required.

Maximum Power Dissipation (Abs): 0.31 W

Suitable for applications where power dissipation needs are within this range.

Package Style (Meter): SMALL OUTLINE

Compact package style that saves space on the circuit board.

Minimum DC Current Gain (hFE): 80

Provides a high current gain, ensuring efficient performance in amplification circuits.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance.

Maximum Collector-Emitter Voltage: 50 V

Safe operating voltage range for various applications.

Transistor Element Material: SILICON

High-quality material for reliable and consistent performance.

Maximum Collector Current (IC): 0.1 A

Can handle up to 0.1A of collector current, suitable for many low-power applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable finish for soldering and connection reliability.

Terminal Position: DUAL

Dual terminal position for flexible installation and connections.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds during assembly.

Peak Reflow Temperature °C: 260

Soldering temperature of 260°C for efficient and reliable soldering during assembly.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5214T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 4.7

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN5214T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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