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MUN5235DW1T1G

Onsemi

MUN5235DW1T1G by Onsemi

MUN5235DW1T1G by Onsemi is a NPN BJT transistor with VCEsat of 0.25V, hFE of 80, and IC of 0.1A. Ideal for switching applications, it has a max operating temp of 150°C and collector-emitter voltage of 50V. This small outline package features Gull Wing terminals and built-in resistors for efficient performance.

Median Price

$0.051

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 11,874 parts In-Stock

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$0.240

100+ parts

$0.091

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$0.059

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Mouser Electronics

USA . 10,348 parts In-Stock

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$0.240

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$0.092

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$0.240

$0.092

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$0.045

Arrow

USA . 312,000 parts In-Stock

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Verical

USA . 312,000 parts In-Stock

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Chip1Stop

Japan . 5,274 parts In-Stock

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Master Electronics

USA . 3,000 parts In-Stock

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Rochester

USA . 2,780 parts In-Stock

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$0.034

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$0.028

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2,780

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Farnell

UK . 1,959 parts In-Stock

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1,959

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Element14

Singapore . 1,959 parts In-Stock

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Newark

USA . 1,814 parts In-Stock

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$0.089

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Nova Conductors

Japan . 100 parts In-Stock

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$0.056

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100

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Digiode

USA . 914 parts In-Stock

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J2 Sourcing AB

Sweden . 755,325 parts In-Stock

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Chip Stock

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Bristol Electronics

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Inventory MP

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Vyrian

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NAC Semi

USA . 18,000 parts In-Stock

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Semi Source

USA . 4,539 parts In-Stock

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R&J Components

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PC Components Company LLC

USA . 3,000 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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A&K Electronics

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Rotakorn

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Cyclops Electronics Ltd

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LIBRA Elektronik GmbH

Germany . 330 parts In-Stock

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Ampacity Inc.

Singapore . 29,523 parts In-Stock

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Semicontronic

India . 29,222 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 2,164 parts In-Stock

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Corphita

USA . 944 parts In-Stock

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Continental Prestige Electronics

USA . 7,610 parts In-Stock

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$0.098

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$0.042

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7,610

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$0.098

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Aztec Data Supply Inc.

USA . 4,321 parts In-Stock

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$0.742

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Perfect Parts

USA . 3,049,930 parts In-Stock

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Eastek

USA . 1,257,000 parts In-Stock

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GreenTree Electronics

Israel . 396,000 parts In-Stock

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RC Electronics

USA . 126,546 parts In-Stock

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$0.060

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Infinite Electronics LLP (Excess)

. 66,291 parts In-Stock

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Glotronic Ltd.

UK . 31,200 parts In-Stock

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BidChips

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iBuyXS LLC

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,498 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 11,647 parts In-Stock

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TANS Electronics

Latvia . 5,752 parts In-Stock

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SupplyDigital Components

Austria . 4,180 parts In-Stock

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Kepictronics

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Assy Fe

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Computer Components Inc. - USA

USA . 2,791 parts In-Stock

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Formix International (Excess)

India . 355 parts In-Stock

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Kulean Microsystems

USA . 216 parts In-Stock

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UHIMA Technologies

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Problanco Electronics

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Overview

Discover the power of the MUN5235DW1T1G by Onsemi, a top-quality Small Signal Bipolar Junction Transistor designed for switching applications. With its NPN configuration and built-in resistors, this transistor offers seamless performance and reliability. Manufactured by Onsemi, known for its cutting-edge technology and superior products, this transistor delivers unmatched value and benefits to customers. Whether you're looking to enhance your electronic projects or streamline your manufacturing processes, the MUN5235DW1T1G is the perfect choice for all your needs. Elevate your designs with this high-performance transistor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that ensures long-term reliability.

Polarity or Channel Type: NPN

NPN type allows for easy integration into various electronic circuits.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Offers flexibility and convenience for circuit design.

Transistor Application: SWITCHING

Ideal for fast switching applications with minimal power loss.

Surface Mount: YES

Easy to mount on PCBs, saving space and enhancing overall circuit efficiency.

Maximum VCEsat: 0.25 V

Low saturation voltage ensures efficient power management.

Package Shape: RECTANGULAR

Compact shape for easy integration in tight spaces.

Terminal Form: GULL WING

Provides secure and reliable connections in circuit assembly.

No. of Elements: 2

Dual elements for increased functionality in circuit design.

No. of Terminals: 6

Multiple terminals allow for versatile connectivity options.

Maximum Power Dissipation (Abs): 0.385 W

Can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Streamlined design for efficient PCB layout and component placement.

Minimum DC Current Gain (hFE): 80

High gain value ensures stable and reliable performance in amplification circuits.

Maximum Operating Temperature: 150 °C

Wide temperature range for operation in various environmental conditions.

Maximum Collector-Emitter Voltage: 50 V

Can handle high voltage levels, making it versatile for different applications.

Transistor Element Material: SILICON

High-quality material for reliable performance and long lifespan.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions without any issues.

Maximum Collector Current (IC): 0.1 A

Supports high collector current for various applications.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability.

Terminal Position: DUAL

Dual terminal position for flexible circuit connections.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures stable solder joints for robust connections.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN5235DW1T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 21.36

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum VCEsat:

.25 V

Trade Compliance

MUN5235DW1T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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