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MT9V024IA7XTR-DP1

Onsemi

MT9V024IA7XTR-DP1 by Onsemi

MT9V024IA7XTR-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications, it features Tin/Silver/Copper terminal finish and is suitable for various imaging needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,934 parts In-Stock

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Digiode

USA . 2,418 parts In-Stock

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2,418

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Distributors (Availability)

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AZTECH Wire

Italy . 36 parts In-Stock

1+ parts

$21.890

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36

$21.890

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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SupplyDigital Components

Austria . 6,647 parts In-Stock

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6,647

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Problanco Electronics

Mexico . 3,066 parts In-Stock

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3,066

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Corphita

USA . 1,850 parts In-Stock

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1,850

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Kulean Microsystems

USA . 1,612 parts In-Stock

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1,612

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TANS Electronics

Latvia . 1,145 parts In-Stock

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1,145

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UHIMA Technologies

Türkiye . 904 parts In-Stock

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904

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Corohmni

South Africa . 384 parts In-Stock

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384

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Overview

Capture every moment in stunning detail with the MT9V024IA7XTR-DP1 Image Sensor by Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge technology that redefines image sensor capabilities. Perfect for a wide range of applications, this sensor offers unrivaled clarity and precision, allowing you to create breathtaking visuals with ease. Whether you're a photography enthusiast or a professional filmmaker, the MT9V024IA7XTR-DP1 provides exceptional value and performance that will elevate your work to new heights.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high resolution image capture, resulting in clear and detailed images.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors offer low power consumption and high quality image output, making this sensor efficient and effective.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper in the terminal finish ensures good conductivity and durability, increasing the longevity of the sensor.

Optical Format (inch): 1/3

The 1/3 inch optical format provides good balance between compact size and image quality, making it suitable for a wide range of applications.

Termination Type: SOLDER

The solder termination type ensures secure connections and reliable performance, making the sensor robust and stable over time.

Frame Rate: 60 fps

With a high frame rate of 60 fps, this sensor can capture fast moving objects with smooth and clear motion, ideal for applications requiring real-time image processing.

Array Type: FRAME

The frame array type allows for multiple pixels to be read simultaneously, improving efficiency and speed in image capture.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables easy installation and integration into various devices and systems, providing flexibility in design and application.

Technical Specifications

Image Sensors MT9V024IA7XTR-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100; GLOBAL SHUTTER

Array Type:

FRAME

Frame Rate:

60 fps

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Pixel Size (um):

6X6

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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