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MC10LVEP11DTR2

Onsemi

MC10LVEP11DTR2 by Onsemi

MC10LVEP11DTR2 clock driver by Onsemi features 0.36 ns propagation delay, differential input conditioning, and 2.5V nominal voltage. Ideal for industrial applications requiring fast signal transmission in a compact package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,363 parts In-Stock

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Digiode

USA . 1,834 parts In-Stock

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AZTECH Wire

Italy . 596 parts In-Stock

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$18.350

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Component Stockers USA

USA . 564 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,561 parts In-Stock

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TANS Electronics

Latvia . 5,716 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 4,252 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 798 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 243 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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Overview

Enhance your clock driver and buffer performance with the MC10LVEP11DTR2 from Onsemi. Crafted with precision and excellence, this product offers unparalleled reliability and efficiency in clock signal distribution. Ideal for a wide range of applications, this high-quality device ensures optimal functionality and seamless operation. Experience the benefits of advanced technology and exceptional design with the MC10LVEP11DTR2, delivering value and advantages that will elevate your system to new heights. Trust Onsemi for top-notch quality and superior performance in clock drivers & buffers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 0.36 ns

Low propagation delay ensures efficient and fast signal transmission within the circuit.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise reduction and improved signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Suitable supply voltage for efficient operation and performance of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers MC10LVEP11DTR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

10LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.36 ns

Propagation Delay (tpd):

.31 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC10LVEP11DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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