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MC10EP139DWR2G

Onsemi

MC10EP139DWR2G by Onsemi

MC10EP139DWR2G clock driver by Onsemi features 1.1ns propagation delay, operates at -40 to 85 °C, and supports differential input conditioning. Ideal for industrial applications requiring ECL technology with a supply voltage range of 3-5.5V.

Median Price

$10.879

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

$9.670

1k+ parts

$8.650

10k+ parts

$8.140

4,975

-

$9.670

$8.650

$8.140

Verical

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

$12.088

1k+ parts

$10.813

10k+ parts

$10.175

4,975

-

$12.088

$10.813

$10.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 96 parts In-Stock

1+ parts

$10.232

100+ parts

-

1k+ parts

-

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-

96

$10.232

-

-

-

Vyrian

USA . 6,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

6,957

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,974 parts In-Stock

1+ parts

$9.693

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$9.693

-

-

-

Corohmni

South Africa . 64 parts In-Stock

1+ parts

$9.730

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$9.730

-

-

-

Component Stockers USA

USA . 4,550 parts In-Stock

1+ parts

$10.970

100+ parts

$10.310

1k+ parts

$9.320

10k+ parts

-

4,550

$10.970

$10.310

$9.320

-

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$12.250

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$12.250

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$38.944

100+ parts

$35.439

1k+ parts

$31.934

10k+ parts

-

5,000

$38.944

$35.439

$31.934

-

Problanco Electronics

Mexico . 8,233 parts In-Stock

1+ parts

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8,233

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SupplyDigital Components

Austria . 7,608 parts In-Stock

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7,608

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Continental Prestige Electronics

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.170

10k+ parts

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4,975

-

-

$9.170

-

TANS Electronics

Latvia . 4,684 parts In-Stock

1+ parts

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4,684

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Microchip USA

USA . 4,017 parts In-Stock

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4,017

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Kulean Microsystems

USA . 2,328 parts In-Stock

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2,328

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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494

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Overview

Enhance your clock signal management with the MC10EP139DWR2G by Onsemi. Designed with precision and reliability in mind, this clock driver offers unparalleled performance in a wide range of applications. From telecommunications to data communications, this product ensures seamless signal transmission with its differential input conditioning and ultra-fast propagation delay. Trust Onsemi's expertise in clock drivers & buffers to deliver top-notch quality and value to meet your needs. Experience the difference with the MC10EP139DWR2G and elevate your system's performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 1.1 ns

The low propagation delay ensures that the clock signals are accurately and quickly distributed, minimizing delays in the system.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, ensuring stable and precise clock signal distribution.

Nominal Supply Voltage / Vsup (V): 3.3

The specified supply voltage ensures compatibility with various electronic systems and devices that operate on a 3.3V power supply.

No. of True Outputs: 4

Having multiple true outputs allows for the clock signals to be distributed to multiple components or subsystems simultaneously, increasing the versatility of the clock driver.

Technical Specifications

Clock Drivers & Buffers MC10EP139DWR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC10EP139DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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