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MC10EP11DTG

Onsemi

MC10EP11DTG by Onsemi

MC10EP11DTG clock driver by Onsemi features 0.32 ns propagation delay, 3.3V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential input conditioning and ECL technology in a small outline package.

Median Price

$8.089

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 46 parts In-Stock

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$9.590

100+ parts

$5.890

1k+ parts

$5.790

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46

$9.590

$5.890

$5.790

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DigiKey

USA . 41 parts In-Stock

1+ parts

$9.630

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$6.971

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41

$9.630

$6.971

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Rochester

USA . 22,843 parts In-Stock

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-

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$5.270

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$4.720

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$4.440

22,843

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$5.270

$4.720

$4.440

Verical

USA . 9,789 parts In-Stock

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$6.588

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$5.900

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$5.900

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Flip Electronics (Authorized)

USA . 9,400 parts In-Stock

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Digiode

USA . 2,263 parts In-Stock

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$5.576

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2,263

$5.576

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Component Electronics Inc.

Canada . 4 parts In-Stock

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$6.150

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$4.620

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$4.000

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4

$6.150

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$4.000

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Flip Electronics

USA . 8,900 parts In-Stock

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Vyrian

USA . 5,008 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 912 parts In-Stock

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Bristol Electronics

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Prism Electronics

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Inventory MP

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Corphita

USA . 1,041 parts In-Stock

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$5.283

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$5.283

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Corohmni

South Africa . 337 parts In-Stock

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$5.870

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337

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Continental Prestige Electronics

USA . 22,843 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 7,633 parts In-Stock

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Kulean Microsystems

USA . 7,225 parts In-Stock

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TANS Electronics

Latvia . 5,417 parts In-Stock

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SupplyDigital Components

Austria . 3,328 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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Overview

Discover the power of precision with the MC10EP11DTG clock driver by Onsemi. Unleash unparalleled performance and reliability in your applications with this top-of-the-line product from a trusted manufacturer. Designed for clock drivers & buffers, this gem boasts a lightning-fast propagation delay of just 0.32 ns, making it perfect for a wide range of industrial uses. With a nominal supply voltage of 3.3V and dual terminal position, this small outline package offers unmatched value and efficiency. Upgrade your systems with the MC10EP11DTG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for various environments.

Propagation Delay At Nominal Supply: 0.32 ns

Low propagation delay ensures fast signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures accurate signal transmission and noise immunity, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides compatibility with standard power sources.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions and ensure reliable operation.

Technology: ECL

Utilizing Emitter Coupled Logic technology offers high-speed operation and low power consumption, making it a suitable choice for high-performance applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product can withstand moderate exposure to humidity during manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with various power sources and flexibility in system design.

Technical Specifications

Clock Drivers & Buffers MC10EP11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V

Family:

10EP

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.12 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC10EP11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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