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MC100LVEP111FA

Onsemi

MC100LVEP111FA by Onsemi

MC100LVEP111FA clock driver by Onsemi features 0.5 ns propagation delay, 10 true outputs, and -40 to 85 °C operating temp. Ideal for industrial applications requiring ECL technology with differential mux input conditioning in a flatpack package.

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Overview

Enhance the performance of your clock drivers and buffers with the MC100LVEP111FA from Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. The MC100LVEP111FA offers customers exceptional value with its fast propagation delay, differential mux input conditioning, and open-emitter output characteristics. Upgrade your system with this top-of-the-line clock driver and buffer for seamless operation and improved efficiency. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 0.625 ns

Low propagation delay ensures fast and efficient signal processing.

Surface Mount: YES

Surface mount capability makes installation and integration easy.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning allows for versatile signal handling.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage for compatibility with other components.

No. of Terminals: 32

Sufficient terminals for connecting to various components and circuits.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design saves space and enables compact system integration.

Maximum Operating Temperature: 85 °C

High operating temperature capability for reliable performance in various environments.

Output Characteristics: OPEN-EMITTER

Open-emitter output for flexible signal routing and customization.

Terminal Finish: TIN LEAD

Tin lead finish for reliable electrical connections.

Technology: ECL

ECL technology for high-speed digital signal processing.

Technical Specifications

Clock Drivers & Buffers MC100LVEP111FA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.625 ns

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

MC100LVEP111FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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