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MC100LVE310FNR2G

Onsemi

MC100LVE310FNR2G by Onsemi

MC100LVE310FNR2G clock driver by Onsemi features 0.8ns propagation delay, 3.3V nominal voltage, and 28 terminals. Ideal for industrial applications requiring ECL technology with differential mux input conditioning and surface mount capability.

Median Price

$10.708

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 488 parts In-Stock

1+ parts

$13.280

100+ parts

$7.284

1k+ parts

$6.743

10k+ parts

-

488

$13.280

$7.284

$6.743

-

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$28.282

100+ parts

$25.737

1k+ parts

$23.191

10k+ parts

-

3,000

$28.282

$25.737

$23.191

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Chip1Stop

Japan . 441 parts In-Stock

1+ parts

$38.900

100+ parts

$16.200

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-

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441

$38.900

$16.200

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Farnell

UK . 13,202 parts In-Stock

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$7.410

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$7.410

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Rochester

USA . 12,202 parts In-Stock

1+ parts

-

100+ parts

$6.510

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$5.820

10k+ parts

$5.480

12,202

-

$6.510

$5.820

$5.480

Verical

USA . 5,976 parts In-Stock

1+ parts

-

100+ parts

$8.137

1k+ parts

$7.275

10k+ parts

$6.850

5,976

-

$8.137

$7.275

$6.850

Distributors (In-Stock)

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Digiode

USA . 1,991 parts In-Stock

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$6.888

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-

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$6.888

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Vyrian

USA . 8,469 parts In-Stock

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8,469

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Semi Source

USA . 1,115 parts In-Stock

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Corphita

USA . 393 parts In-Stock

1+ parts

$6.525

100+ parts

-

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393

$6.525

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

$7.250

100+ parts

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442

$7.250

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Component Stockers USA

USA . 14,498 parts In-Stock

1+ parts

$7.370

100+ parts

$6.920

1k+ parts

$6.260

10k+ parts

$6.260

14,498

$7.370

$6.920

$6.260

$6.260

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$28.282

100+ parts

$25.737

1k+ parts

$23.191

10k+ parts

-

3,000

$28.282

$25.737

$23.191

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Continental Prestige Electronics

USA . 12,202 parts In-Stock

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$7.410

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12,202

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$7.410

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QUARKTWIN TECHNOLOGY LTD

USA . 8,298 parts In-Stock

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Problanco Electronics

Mexico . 7,732 parts In-Stock

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Kulean Microsystems

USA . 4,628 parts In-Stock

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SupplyDigital Components

Austria . 4,456 parts In-Stock

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Microchip USA

USA . 3,715 parts In-Stock

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TANS Electronics

Latvia . 3,532 parts In-Stock

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Perfect Parts

USA . 3,518 parts In-Stock

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Authorized Procurement Solutions

USA . 441 parts In-Stock

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441

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GreenTree Electronics

Israel . 441 parts In-Stock

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441

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Metaverse IC Inc.

Canada . 225 parts In-Stock

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Overview

Enhance your clock signal transmission with the MC100LVE310FNR2G by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi delivers top-quality products for various applications. The MC100LVE310FNR2G offers fast propagation delay, differential mux input conditioning, and a wide operating temperature range. Ensure precise timing and reliable performance with this chip carrier package that is surface mountable. Trust Onsemi to provide unmatched value and benefits to meet your clock driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.85 ns

Allows for fast signal propagation, which is crucial for clock driver and buffer functionality.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Input Conditioning: DIFFERENTIAL MUX

Enables effective signal processing for accurate clock signal distribution.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltage levels, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high-temperature environments, suitable for industrial settings.

Technical Specifications

Clock Drivers & Buffers MC100LVE310FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC100LVE310FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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