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PLMK00804BQWRGTTQ1

Texas Instruments

PLMK00804BQWRGTTQ1 by Texas Instruments

PLMK00804BQWRGTTQ1 by Texas Instruments is a clock driver with 4 true outputs, operating temperature range of -40 to 125°C. It features differential mux input conditioning and AEC-Q100 screening level, suitable for automotive applications. Package style is chip carrier with heat sink/slug, surface mountable with 16 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,893 parts In-Stock

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Digiode

USA . 4,164 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Andel Nordic

Denmark . 2,823 parts In-Stock

1+ parts

$1.806

100+ parts

-

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$1.734

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$1.734

2,823

$1.806

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$1.734

$1.734

One Stop Electronics

USA . 1,444 parts In-Stock

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$3.000

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1,444

$3.000

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AZTECH Wire

Italy . 712 parts In-Stock

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$5.840

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712

$5.840

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Parana Technologies

USA . 1,776 parts In-Stock

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$17.011

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$17.235

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1,776

$17.011

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$17.235

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ChromeModa Solutions

Germany . 2,765 parts In-Stock

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$19.113

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$15.673

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$19.113

$15.673

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

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$19.113

100+ parts

$18.157

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$17.202

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2,378

$19.113

$18.157

$17.202

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Corohmni

South Africa . 21 parts In-Stock

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$25.820

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21

$25.820

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Ampacity Inc.

Singapore . 1,512 parts In-Stock

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$52.000

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$52.000

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Continental Prestige Electronics

USA . 2,596 parts In-Stock

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Corphita

USA . 2,261 parts In-Stock

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DigiPath Technology Company

USA . 1,613 parts In-Stock

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$17.232

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$17.232

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Argo Parts USA

USA . 1,292 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Elevate your automotive electronics with the PLMK00804BQWRGTTQ1 Clock Drivers & Buffers by Texas Instruments. This high-quality chip carrier features differential mux input conditioning and AEC-Q100 screening, ensuring reliable performance in a wide range of temperatures. With 16 terminals and 4 true outputs, this square-shaped package offers superior precision and efficiency for your automotive applications. Trust Texas Instruments for cutting-edge technology that delivers value and innovation to meet your needs. Upgrade your clock driver solution today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount onto PCBs, reducing assembly time and costs.

Input Conditioning: DIFFERENTIAL MUX

Allows for multiple inputs to be processed efficiently, increasing versatility and functionality.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability in harsh operating environments.

Package Shape: SQUARE

Optimal shape for efficient use of space on the PCB.

Nominal Supply Voltage: 3.3V

Compatible with a standard voltage supply, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature environments, providing reliable performance in a wide range of conditions.

No. of True Outputs: 4

Provides multiple output options, increasing flexibility in design and functionality.

Maximum Supply Voltage: 3.465V

Capable of handling minor fluctuations in the supply voltage, ensuring stable operation.

Technical Specifications

Clock Drivers & Buffers PLMK00804BQWRGTTQ1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

PLMK

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N16

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

PLMK00804BQWRGTTQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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