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MC100LVE310FNG

Onsemi

MC100LVE310FNG by Onsemi

MC100LVE310FNG clock driver by Onsemi features 0.8 ns propagation delay, 3.3V nominal voltage, and 28 terminals in a square chip carrier package. Ideal for industrial applications requiring differential mux input conditioning and ECL technology for high-speed signal transmission.

Median Price

$5.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 4,633 parts In-Stock

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-

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$5.120

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$4.580

10k+ parts

$4.310

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$5.120

$4.580

$4.310

Verical

USA . 2,248 parts In-Stock

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$6.400

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$5.725

10k+ parts

$5.388

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$6.400

$5.725

$5.388

Distributors (In-Stock)

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Digiode

USA . 1,193 parts In-Stock

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$5.415

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Vyrian

USA . 3,226 parts In-Stock

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Connector Distribution Corp

USA . 109 parts In-Stock

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Right Parts Inc.

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Prism Electronics

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Distributors (Availability)

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Corphita

USA . 574 parts In-Stock

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$5.130

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$5.130

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Corohmni

South Africa . 111 parts In-Stock

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$5.150

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AZTECH Wire

Italy . 943 parts In-Stock

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$20.270

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$20.270

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$22.257

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$20.254

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$18.251

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$22.257

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$18.251

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Kulean Microsystems

USA . 7,507 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 4,156 parts In-Stock

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SupplyDigital Components

Austria . 4,129 parts In-Stock

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TANS Electronics

Latvia . 2,864 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Perfect Parts

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Microchip USA

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Kepictronics

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Overview

Elevate your clock driver and buffer needs with the MC100LVE310FNG from Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for various applications in the Clock Drivers & Buffers category. With a propagation delay of 0.8 ns and differential mux input conditioning, this chip carrier package offers superior performance and precision. The industrial-grade technology ensures durability in extreme conditions, making it a valuable asset for your projects. Trust Onsemi to provide the cutting-edge technology you need for seamless integration and top-notch results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and resistance to physical damage, suitable for various applications.

Propagation Delay At Nominal Supply: 0.85 ns

Fast propagation delay ensures efficient performance and high-speed signal processing.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage requirements in many electronic devices.

Minimum Operating Temperature: -40 °C

Can operate in harsh cold environments without performance degradation.

Width: 11.505 mm

Compact size allows for versatile placement within electronic systems.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures reliability under normal humidity conditions.

Technical Specifications

Clock Drivers & Buffers MC100LVE310FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100LVE310FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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