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MC100LVE210FNG

Onsemi

MC100LVE210FNG by Onsemi

MC100LVE210FNG clock driver by Onsemi features 0.75ns propagation delay, 3.3V nominal voltage, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring differential input conditioning and quad terminal position in a square chip carrier package.

Median Price

$5.075

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$5.160

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8

$5.160

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Rochester

USA . 5,776 parts In-Stock

1+ parts

-

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$4.990

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$4.460

10k+ parts

$4.200

5,776

-

$4.990

$4.460

$4.200

Verical

USA . 2,413 parts In-Stock

1+ parts

-

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$6.237

1k+ parts

$5.575

10k+ parts

$5.250

2,413

-

$6.237

$5.575

$5.250

Arrow

USA . 8 parts In-Stock

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-

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$4.731

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8

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$4.731

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Distributors (In-Stock)

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Digiode

USA . 403 parts In-Stock

1+ parts

$4.902

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403

$4.902

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Vyrian

USA . 5,200 parts In-Stock

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5,200

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Sea View Technologies

USA . 37 parts In-Stock

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Bristol Electronics

USA . 37 parts In-Stock

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R&J Components

USA . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 290 parts In-Stock

1+ parts

$4.644

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290

$4.644

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Corohmni

South Africa . 266 parts In-Stock

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$4.731

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266

$4.731

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Component Stockers USA

USA . 4,767 parts In-Stock

1+ parts

$5.340

100+ parts

$5.390

1k+ parts

$4.870

10k+ parts

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4,767

$5.340

$5.390

$4.870

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$12.780

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195

$12.780

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$24.479

100+ parts

$22.276

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$20.073

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3,000

$24.479

$22.276

$20.073

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TANS Electronics

Latvia . 6,831 parts In-Stock

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Kulean Microsystems

USA . 5,907 parts In-Stock

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Continental Prestige Electronics

USA . 5,776 parts In-Stock

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SupplyDigital Components

Austria . 3,941 parts In-Stock

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Problanco Electronics

Mexico . 2,798 parts In-Stock

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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Microchip USA

USA . 378 parts In-Stock

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Perfect Parts

USA . 105 parts In-Stock

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ChipstoGo Electronic ltd

UK . 37 parts In-Stock

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Overview

Enhance your clock signal precision with the MC100LVE210FNG from Onsemi. With a reputation for top-quality products, Onsemi delivers clock drivers and buffers that are reliable and efficient. This versatile chip carrier offers differential input conditioning, low propagation delay, and operates at an industrial temperature grade. Perfect for a wide range of applications, this clock driver is a valuable asset for any project. Trust Onsemi to provide the high-performance components you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection to the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.75 ns

Low propagation delay ensures fast signal processing and synchronization, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during product manufacturing.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this clock driver suitable for applications sensitive to signal quality.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with many digital systems and devices.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this clock driver ideal for applications requiring precise timing and synchronization.

Technical Specifications

Clock Drivers & Buffers MC100LVE210FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100LVE210FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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