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MC100H646FNR2G

Onsemi

MC100H646FNR2G by Onsemi

MC100H646FNR2G clock driver by Onsemi features 7ns propagation delay, 6.4ns tpd, and 24A max I (ol). Ideal for applications requiring differential mux input conditioning in a square chip carrier package with 28 terminals.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,650 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

3,650

-

$5.610

$5.020

$4.720

Verical

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

$5.900

3,500

-

$7.013

$6.275

$5.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,206 parts In-Stock

1+ parts

$5.938

100+ parts

-

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1,206

$5.938

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Vyrian

USA . 7,835 parts In-Stock

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7,835

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,358 parts In-Stock

1+ parts

$5.625

100+ parts

-

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1,358

$5.625

-

-

-

Corohmni

South Africa . 187 parts In-Stock

1+ parts

$5.650

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-

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187

$5.650

-

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-

Component Stockers USA

USA . 3,014 parts In-Stock

1+ parts

$6.460

100+ parts

$6.070

1k+ parts

$5.490

10k+ parts

-

3,014

$6.460

$6.070

$5.490

-

AZTECH Wire

Italy . 154 parts In-Stock

1+ parts

$10.320

100+ parts

-

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154

$10.320

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 21,286 parts In-Stock

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21,286

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Problanco Electronics

Mexico . 7,762 parts In-Stock

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7,762

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TANS Electronics

Latvia . 6,770 parts In-Stock

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6,770

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Microchip USA

USA . 5,126 parts In-Stock

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Kepictronics

USA . 4,150 parts In-Stock

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4,150

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Continental Prestige Electronics

USA . 3,650 parts In-Stock

1+ parts

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100+ parts

$5.320

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3,650

-

$5.320

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Kulean Microsystems

USA . 2,644 parts In-Stock

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2,644

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SupplyDigital Components

Austria . 2,195 parts In-Stock

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2,195

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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315

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Overview

Enhance your clocking system with the MC100H646FNR2G by Onsemi. Built with precision and reliability, Onsemi delivers top-notch clock drivers & buffers that cater to a variety of applications. This product offers unparalleled value with its fast propagation delay, low power consumption, and 3-state output characteristics. Whether you're in need of differential mux input conditioning or high-speed signal processing, the MC100H646FNR2G provides the performance and efficiency you deserve. Upgrade your systems today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to high temperatures, ensuring the product longevity and reliability.

Propagation Delay At Nominal Supply: 7 ns

Fast propagation delay ensures efficient operation and synchronization within the circuit.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing helps improve signal integrity and reduce noise interference.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling and switching signals, allowing for efficient data transmission.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making it suitable for advanced electronic applications.

Technical Specifications

Clock Drivers & Buffers MC100H646FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100H

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

6.4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H646FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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