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MC100H643FNR2G

Onsemi

MC100H643FNR2G by Onsemi

MC100H643FNR2G clock driver by Onsemi has 5.9ns propagation delay, 8 true outputs, and operates at a max temp of 85°C. Ideal for applications requiring differential latched input conditioning in commercial extended temperature grade environments.

Median Price

$12.037

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 410 parts In-Stock

1+ parts

$28.300

100+ parts

$15.200

1k+ parts

-

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410

$28.300

$15.200

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Rochester

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

$9.630

1k+ parts

$8.620

10k+ parts

$8.110

2,220

-

$9.630

$8.620

$8.110

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$12.037

1k+ parts

$10.775

10k+ parts

$10.137

1,000

-

$12.037

$10.775

$10.137

Distributors (In-Stock)

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Digiode

USA . 1,099 parts In-Stock

1+ parts

$10.165

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1,099

$10.165

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Vyrian

USA . 6,361 parts In-Stock

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6,361

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Distributors (Availability)

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Corphita

USA . 592 parts In-Stock

1+ parts

$9.630

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-

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592

$9.630

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AZTECH Wire

Italy . 398 parts In-Stock

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$10.340

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398

$10.340

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Corohmni

South Africa . 194 parts In-Stock

1+ parts

$10.700

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194

$10.700

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Problanco Electronics

Mexico . 5,055 parts In-Stock

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Kulean Microsystems

USA . 5,050 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,876 parts In-Stock

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Perfect Parts

USA . 3,214 parts In-Stock

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Continental Prestige Electronics

USA . 2,220 parts In-Stock

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$9.120

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$9.120

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TANS Electronics

Latvia . 1,924 parts In-Stock

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UHIMA Technologies

Türkiye . 816 parts In-Stock

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Authorized Procurement Solutions

USA . 410 parts In-Stock

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410

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GreenTree Electronics

Israel . 410 parts In-Stock

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410

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SupplyDigital Components

Austria . 397 parts In-Stock

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397

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Microchip USA

USA . 388 parts In-Stock

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388

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Overview

Discover the MC100H643FNR2G by Onsemi, a cutting-edge clock driver and buffer that delivers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this product is designed to meet the highest quality standards. Ideal for applications requiring precise timing and signal distribution, the MC100H643FNR2G offers a fast propagation delay of 5.9 ns and input conditioning for differential latched signals. With its innovative technology and robust construction, this clock driver provides customers with unmatched value and efficiency. Experience the superior quality and advantages of the MC100H643FNR2G for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 5.9 ns

With a fast propagation delay, this clock driver can efficiently synchronize signals in a timely manner.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL LATCHED

Differential latched input conditioning helps in reducing noise and ensuring accurate data transmission, making this product reliable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this clock driver compatible with a wide range of electronic devices and systems.

Maximum I (ol): 48 Amp

With a high output current capability, this clock driver can drive multiple loads without performance degradation.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures reliable performance in various environmental conditions.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this clock driver suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC100H643FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100H

Input Conditioning:

DIFFERENTIAL LATCHED

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H643FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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