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MC100H641FNG

Onsemi

MC100H641FNG by Onsemi

MC100H641FNG clock driver by Onsemi has 6.4 ns propagation delay, 9 true outputs, and operates at 65 MHz. It is used in applications requiring differential latched input conditioning and a nominal voltage of 5V.

Median Price

$7.852

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 79 parts In-Stock

1+ parts

-

100+ parts

$8.725

1k+ parts

$7.813

10k+ parts

$7.350

79

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$8.725

$7.813

$7.350

Rochester

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$6.980

1k+ parts

$6.250

10k+ parts

$5.880

78

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$6.980

$6.250

$5.880

Distributors (In-Stock)

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Digiode

USA . 155 parts In-Stock

1+ parts

$7.391

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155

$7.391

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Vyrian

USA . 3,018 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 105 parts In-Stock

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$5.980

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105

$5.980

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Corphita

USA . 1,937 parts In-Stock

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$7.002

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1,937

$7.002

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Corohmni

South Africa . 126 parts In-Stock

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$7.030

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126

$7.030

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Component Stockers USA

USA . 110 parts In-Stock

1+ parts

$7.880

100+ parts

$7.410

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110

$7.880

$7.410

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AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$16.520

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864

$16.520

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TANS Electronics

Latvia . 5,244 parts In-Stock

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Kulean Microsystems

USA . 3,178 parts In-Stock

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SupplyDigital Components

Austria . 3,046 parts In-Stock

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Problanco Electronics

Mexico . 1,881 parts In-Stock

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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Kepictronics

USA . 272 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 119 parts In-Stock

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Overview

Elevate your clock driver and buffer needs with the MC100H641FNG by Onsemi, a top-tier manufacturer known for delivering superior quality products. Designed for efficiency and reliability, this chip carrier package offers differential latched input conditioning and a low propagation delay of 6.4 ns, ensuring seamless performance in various applications. With a nominal supply voltage of 5V and 9 true outputs, this square-shaped device is the perfect solution for your timing requirements. Trust in Onsemi to provide cutting-edge technology that brings value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 6.4 ns

The low propagation delay ensures accurate and synchronized clock signal distribution.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Input Conditioning: DIFFERENTIAL LATCHED

Differential latched input conditioning helps eliminate noise and ensure reliable data transmission.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it compatible with standard power supplies.

No. of Terminals: 28

With a high number of terminals, this product can support complex circuit configurations.

Maximum I (ol): 24 Amp

The high output current capability allows for driving multiple loads without external amplification.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, ideal for clock distribution applications.

Technical Specifications

Clock Drivers & Buffers MC100H641FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100H

Input Conditioning:

DIFFERENTIAL LATCHED

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.35 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Minimum fmax:

65 MHz

Trade Compliance

MC100H641FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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