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MC100EP809FAG

Onsemi

MC100EP809FAG by Onsemi

MC100EP809FAG clock driver by Onsemi features 1ns propagation delay, 32 terminals, and 9 true outputs. Ideal for applications requiring high-speed signal distribution in commercial extended temperature environments. Package style: flatpack, low profile with differential mux input conditioning.

Median Price

$8.438

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 324 parts In-Stock

1+ parts

-

100+ parts

$7.500

1k+ parts

$6.710

10k+ parts

$6.310

324

-

$7.500

$6.710

$6.310

Verical

USA . 244 parts In-Stock

1+ parts

-

100+ parts

$9.375

1k+ parts

$8.387

10k+ parts

$7.888

244

-

$9.375

$8.387

$7.888

Distributors (In-Stock)

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Digiode

USA . 2,472 parts In-Stock

1+ parts

$7.914

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-

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2,472

$7.914

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Vyrian

USA . 5,363 parts In-Stock

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5,363

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Distributors (Availability)

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Corphita

USA . 1,798 parts In-Stock

1+ parts

$7.497

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-

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1,798

$7.497

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Corohmni

South Africa . 207 parts In-Stock

1+ parts

$7.530

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207

$7.530

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Component Stockers USA

USA . 302 parts In-Stock

1+ parts

$8.520

100+ parts

$8.000

1k+ parts

-

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302

$8.520

$8.000

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$17.390

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276

$17.390

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.942

100+ parts

$19.967

1k+ parts

$17.992

10k+ parts

-

3,000

$21.942

$19.967

$17.992

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TANS Electronics

Latvia . 8,253 parts In-Stock

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Problanco Electronics

Mexico . 8,183 parts In-Stock

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Kulean Microsystems

USA . 1,801 parts In-Stock

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SupplyDigital Components

Austria . 1,796 parts In-Stock

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UHIMA Technologies

Türkiye . 674 parts In-Stock

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Perfect Parts

USA . 616 parts In-Stock

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Microchip USA

USA . 415 parts In-Stock

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Continental Prestige Electronics

USA . 315 parts In-Stock

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$7.100

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$7.100

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GreenTree Electronics

Israel . 76 parts In-Stock

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Authorized Procurement Solutions

USA . 76 parts In-Stock

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Overview

Experience the unparalleled precision and reliability of the MC100EP809FAG clock driver and buffer by Onsemi. Designed with advanced technology and top-quality materials, this product is perfect for a wide range of applications in the field of clock drivers and buffers. With its exceptional performance and superior design, customers can trust in the value and benefits that this product brings to their projects. Upgrade your systems with the MC100EP809FAG and discover the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Input Conditioning: DIFFERENTIAL MUX

Enables accurate signal processing and communication between different components.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a common supply voltage in many applications.

Propagation Delay (tpd): 1 ns

Provides quick response time for signal transmission.

Output Characteristics: OPEN-EMITTER

Offers flexibility in connecting to other components in the circuit.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed performance.

Minimum fmax: 500 MHz

Capable of handling high-frequency signals effectively.

Technical Specifications

Clock Drivers & Buffers MC100EP809FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

500 MHz

Trade Compliance

MC100EP809FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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