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MC100EP139MNG

Onsemi

MC100EP139MNG by Onsemi

MC100EP139MNG clock driver by Onsemi has 1.1ns propagation delay, operates at -40 to 85 °C, and supports 3.3V nominal voltage. Ideal for industrial applications requiring differential input conditioning and ECL technology in a compact chip carrier package with surface mount capability.

Median Price

$12.098

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 74 parts In-Stock

1+ parts

$9.620

100+ parts

$7.190

1k+ parts

$6.230

10k+ parts

$5.830

74

$9.620

$7.190

$6.230

$5.830

DigiKey

USA . 92 parts In-Stock

1+ parts

$18.280

100+ parts

$16.106

1k+ parts

$16.106

10k+ parts

$16.106

92

$18.280

$16.106

$16.106

$16.106

Rochester

USA . 18,804 parts In-Stock

1+ parts

-

100+ parts

$10.770

1k+ parts

$9.640

10k+ parts

$9.070

18,804

-

$10.770

$9.640

$9.070

Verical

USA . 4,166 parts In-Stock

1+ parts

-

100+ parts

$13.425

1k+ parts

$12.012

10k+ parts

$11.313

4,166

-

$13.425

$12.012

$11.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,544 parts In-Stock

1+ parts

$8.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,544

$8.493

-

-

-

Vyrian

USA . 4,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,936

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,280 parts In-Stock

1+ parts

$8.046

100+ parts

-

1k+ parts

-

10k+ parts

-

2,280

$8.046

-

-

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$9.170

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$9.170

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$9.737

100+ parts

$8.861

1k+ parts

$7.984

10k+ parts

-

10

$9.737

$8.861

$7.984

-

Component Stockers USA

USA . 19,119 parts In-Stock

1+ parts

$12.180

100+ parts

$11.460

1k+ parts

$10.350

10k+ parts

$10.350

19,119

$12.180

$11.460

$10.350

$10.350

Microchip USA

USA . 432 parts In-Stock

1+ parts

$50.680

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$50.680

-

-

-

Continental Prestige Electronics

USA . 19,054 parts In-Stock

1+ parts

-

100+ parts

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19,054

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 7,042 parts In-Stock

1+ parts

-

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7,042

-

-

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SupplyDigital Components

Austria . 5,873 parts In-Stock

1+ parts

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5,873

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Problanco Electronics

Mexico . 5,233 parts In-Stock

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5,233

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TANS Electronics

Latvia . 4,748 parts In-Stock

1+ parts

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4,748

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Kulean Microsystems

USA . 2,888 parts In-Stock

1+ parts

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2,888

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UHIMA Technologies

Türkiye . 740 parts In-Stock

1+ parts

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740

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Perfect Parts

USA . 485 parts In-Stock

1+ parts

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485

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GreenTree Electronics

Israel . 83 parts In-Stock

1+ parts

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83

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Overview

Enhance your clock signal precision with the MC100EP139MNG by Onsemi. Designed with top-notch quality and reliability, this clock driver ensures seamless operation in various applications. From networking to telecommunications, this product guarantees low propagation delay and efficient performance, giving you the edge in your projects. With its advanced technology and industrial-grade construction, the MC100EP139MNG is the perfect choice for those seeking high-quality clock drivers & buffers that deliver exceptional value and benefits. Trust Onsemi to provide you with cutting-edge solutions that meet your needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.1 ns

Low propagation delay ensures fast and efficient performance of the clock driver.

Nominal Supply Voltage / Vsup (V): 3.3

Matches with commonly used supply voltages in electronic circuits, making it easy to integrate into existing designs.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various environmental conditions without compromising performance.

No. of True Outputs: 4

Multiple true outputs provide flexibility in connecting to different components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer versatility in mounting options and space requirements.

Technical Specifications

Clock Drivers & Buffers MC100EP139MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

MC100EP139MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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