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MC100EP11DR2G

Onsemi

MC100EP11DR2G by Onsemi

MC100EP11DR2G clock driver by Onsemi features a propagation delay of 0.3ns, operates at a nominal voltage of 3.3V, and offers differential input conditioning. This ECL technology device is ideal for applications requiring precise clock signal distribution in industrial temperature environments.

Median Price

$8.920

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,826 parts In-Stock

1+ parts

$8.920

100+ parts

$5.890

1k+ parts

$5.350

10k+ parts

$5.320

2,826

$8.920

$5.890

$5.350

$5.320

DigiKey

USA . 1,243 parts In-Stock

1+ parts

$8.920

100+ parts

$5.890

1k+ parts

$5.344

10k+ parts

$5.207

1,243

$8.920

$5.890

$5.344

$5.207

Chip1Stop

Japan . 2,200 parts In-Stock

1+ parts

$30.400

100+ parts

$12.700

1k+ parts

$8.660

10k+ parts

-

2,200

$30.400

$12.700

$8.660

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Verical

USA . 2,500 parts In-Stock

1+ parts

-

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$4.891

2,500

-

-

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$4.891

Rochester

USA . 51 parts In-Stock

1+ parts

-

100+ parts

$4.850

1k+ parts

$4.340

10k+ parts

$4.090

51

-

$4.850

$4.340

$4.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 505 parts In-Stock

1+ parts

$5.130

100+ parts

-

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505

$5.130

-

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Vyrian

USA . 8,021 parts In-Stock

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-

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8,021

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Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

-

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2,500

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-

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Quantum Digital Technology

USA . 350 parts In-Stock

1+ parts

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350

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Component Sense

UK . 294 parts In-Stock

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294

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 930 parts In-Stock

1+ parts

$4.480

100+ parts

-

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930

$4.480

-

-

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Corphita

USA . 979 parts In-Stock

1+ parts

$4.860

100+ parts

-

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979

$4.860

-

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Corohmni

South Africa . 269 parts In-Stock

1+ parts

$5.267

100+ parts

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269

$5.267

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Microchip USA

USA . 4,985 parts In-Stock

1+ parts

$15.000

100+ parts

$14.790

1k+ parts

$14.680

10k+ parts

$14.570

4,985

$15.000

$14.790

$14.680

$14.570

Perfect Parts

USA . 21,146 parts In-Stock

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Lixinc

USA . 11,491 parts In-Stock

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TANS Electronics

Latvia . 6,745 parts In-Stock

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Kulean Microsystems

USA . 6,622 parts In-Stock

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6,622

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SupplyDigital Components

Austria . 4,680 parts In-Stock

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4,680

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GreenTree Electronics

Israel . 3,920 parts In-Stock

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3,920

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Authorized Procurement Solutions

USA . 3,820 parts In-Stock

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3,820

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Continental Prestige Electronics

USA . 2,851 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Problanco Electronics

Mexico . 2,469 parts In-Stock

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Kepictronics

USA . 918 parts In-Stock

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918

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UHIMA Technologies

Türkiye . 289 parts In-Stock

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289

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Legend Electronics Inc. (Excess)

USA . 269 parts In-Stock

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269

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Speed Components Ltd (Excess)

Israel . 269 parts In-Stock

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269

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iodParts Technologies Inc.

India . 200 parts In-Stock

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200

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Overview

Enhance the performance of your clock systems with the MC100EP11DR2G by Onsemi. Manufactured with precision and quality in mind, this Clock Driver & Buffer offers unmatched reliability and efficiency. Ideal for applications requiring differential input conditioning, this product delivers a propagation delay of just 0.3ns at a nominal supply voltage of 3.3V. With its compact design and industrial temperature grade, the MC100EP11DR2G is perfect for a wide range of electronic devices. Upgrade your systems today and experience the superior quality and value that Onsemi provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides durability and protection for the internal components of the clock driver, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 0.32 ns

Fast propagation delay ensures efficient operation and accurate timing for the clock signals.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into PCB designs, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in minimizing noise and improving signal integrity, resulting in consistent and reliable clock signal distribution.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage of 3.3V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures that the clock driver can withstand harsh operating conditions, providing long-term stability and reliability.

No. of True Outputs: 2

Having multiple true outputs allows for flexibility in clock signal distribution, enabling the clock driver to meet the needs of complex systems.

Technical Specifications

Clock Drivers & Buffers MC100EP11DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V

Family:

10EP

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.12 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EP11DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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