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MC100EL34DG

Onsemi

MC100EL34DG by Onsemi

MC100EL34DG clock driver by Onsemi features 1.21ns propagation delay, operates at -40 to 85°C, and supports up to 1100MHz fmax. Ideal for industrial applications requiring differential input conditioning and a small outline package with gull wing terminals.

Median Price

$7.330

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 366 parts In-Stock

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$3.844

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$3.844

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Chip1Stop

Japan . 426 parts In-Stock

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$4.200

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Mouser Electronics

USA . 133 parts In-Stock

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$8.110

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$7.480

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$7.280

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133

$8.110

$7.480

$7.280

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DigiKey

USA . 72 parts In-Stock

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$11.680

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$8.167

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72

$11.680

$8.167

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Rochester

USA . 14,665 parts In-Stock

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$6.550

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$5.860

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$5.510

14,665

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$6.550

$5.860

$5.510

Verical

USA . 9,624 parts In-Stock

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$8.150

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$7.287

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$6.862

9,624

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$7.287

$6.862

Flip Electronics (Authorized)

USA . 5,760 parts In-Stock

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Digiode

USA . 722 parts In-Stock

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$3.652

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722

$3.652

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Nova Conductors

Japan . 43 parts In-Stock

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$6.940

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Vyrian

USA . 5,917 parts In-Stock

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Flip Electronics

USA . 5,760 parts In-Stock

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Bristol Electronics

USA . 4,158 parts In-Stock

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Lantek

USA . 75 parts In-Stock

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SPM Sales

USA . 54 parts In-Stock

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Sunrise Surplus Inc.

USA . 7 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,288 parts In-Stock

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$3.270

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Corphita

USA . 1,225 parts In-Stock

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$3.460

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$3.460

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Corohmni

South Africa . 341 parts In-Stock

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$3.844

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341

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Microchip USA

USA . 2,326 parts In-Stock

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$32.592

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Problanco Electronics

Mexico . 7,734 parts In-Stock

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Kulean Microsystems

USA . 6,270 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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TANS Electronics

Latvia . 2,801 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.801

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$6.593

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$6.454

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$6.454

SupplyDigital Components

Austria . 1,018 parts In-Stock

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 468 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 75 parts In-Stock

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Kepictronics

USA . 72 parts In-Stock

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Overview

Enhance your clock driver system with the MC100EL34DG by Onsemi. Manufactured with top-quality materials and advanced technology, this clock driver offers precise propagation delay and differential input conditioning for seamless integration. Ideal for industrial applications, this product provides reliable performance and efficient power management. Upgrade your setup with the MC100EL34DG and experience enhanced precision and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 1.21 ns

Low propagation delay ensures efficient and fast signal processing.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with most systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Allows the product to function in low-temperature conditions.

Technical Specifications

Clock Drivers & Buffers MC100EL34DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

1.21 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100EL34DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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