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MC100EL11DTR2

Onsemi

MC100EL11DTR2 by Onsemi

MC100EL11DTR2 clock driver by Onsemi features 0.385 ns propagation delay, 5V nominal voltage, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring differential input conditioning and dual terminal position in a small outline package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,034 parts In-Stock

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Sunrise Surplus Inc.

USA . 2,274 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 408 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$36.075

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$29.582

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Problanco Electronics

Mexico . 7,168 parts In-Stock

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TANS Electronics

Latvia . 5,797 parts In-Stock

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SupplyDigital Components

Austria . 4,292 parts In-Stock

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Kulean Microsystems

USA . 1,684 parts In-Stock

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Corphita

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Corohmni

South Africa . 372 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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Overview

Elevate your clock driver & buffer needs with the MC100EL11DTR2 by Onsemi. Crafted with precision and reliability, this product offers unmatched performance in applications requiring differential input conditioning. With a nominal supply voltage of 5V and a propagation delay as low as 0.385 ns, this small outline, thin profile package is perfect for industrial-grade use. Don't settle for less when you can experience the superior quality and benefits that Onsemi brings to the table. Elevate your projects with the MC100EL11DTR2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides good durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 0.385 ns

A low propagation delay ensures quick signal processing, making this product efficient in time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and improving overall design flexibility.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this product reliable in high-noise environments.

Package Shape: SQUARE

The square package shape provides uniformity in design and facilitates easier positioning on the circuit board, enhancing overall layout aesthetics.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes this product compatible with a wide range of electronic systems, simplifying integration.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making this product ideal for applications requiring fast data processing and efficiency.

Technical Specifications

Clock Drivers & Buffers MC100EL11DTR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

100EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.385 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EL11DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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