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MC100EL11DTG

Onsemi

MC100EL11DTG by Onsemi

MC100EL11DTG clock driver by Onsemi has 0.34 ns propagation delay, operates at -40 to 85 °C, and requires 4.2-5.7 V supply voltage. Ideal for industrial applications requiring differential input conditioning in a small outline package with gull wing terminals.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 16,666 parts In-Stock

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$2.200

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$2.200

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Rochester

USA . 16,430 parts In-Stock

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-

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$2.190

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$1.960

10k+ parts

$1.840

16,430

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$2.190

$1.960

$1.840

Verical

USA . 7,901 parts In-Stock

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$2.450

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7,901

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$2.450

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Distributors (In-Stock)

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Digiode

USA . 1,239 parts In-Stock

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$2.308

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$2.308

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Vyrian

USA . 5,544 parts In-Stock

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Zilex Electronics Inc.

Canada . 180 parts In-Stock

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180

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Semi Source

USA . 68 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,944 parts In-Stock

1+ parts

$2.187

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$2.187

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Corohmni

South Africa . 151 parts In-Stock

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$2.200

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151

$2.200

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Component Stockers USA

USA . 30,159 parts In-Stock

1+ parts

$2.510

100+ parts

$2.360

1k+ parts

$2.140

10k+ parts

$2.140

30,159

$2.510

$2.360

$2.140

$2.140

Ampacity Inc.

Singapore . 13,617 parts In-Stock

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$4.070

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13,617

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AZTECH Wire

Italy . 1,005 parts In-Stock

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$21.590

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$21.590

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Continental Prestige Electronics

USA . 16,667 parts In-Stock

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$2.070

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SupplyDigital Components

Austria . 5,746 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,494 parts In-Stock

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Problanco Electronics

Mexico . 1,892 parts In-Stock

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TANS Electronics

Latvia . 1,305 parts In-Stock

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Microchip USA

USA . 427 parts In-Stock

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UHIMA Technologies

Türkiye . 292 parts In-Stock

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Kulean Microsystems

USA . 206 parts In-Stock

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Overview

Elevate your clock driver and buffer solutions with the MC100EL11DTG by Onsemi. Crafted with precision using advanced technology, this product offers unparalleled performance in clock distribution applications. With a fast propagation delay, differential input conditioning, and a wide operating temperature range, this device ensures reliable signal transmission and synchronization. Trust Onsemi's reputation for quality and innovation to deliver exceptional value and benefits to your projects. Choose the MC100EL11DTG for superior clock drivers and buffers that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.385 ns

Offers fast signal processing, making the clock driver efficient in synchronization tasks.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Enables accurate data transmission and reception, reducing errors in clock signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with most electronic systems.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in various environments.

Peak Reflow Temperature °C: 260

Withstands high temperature during reflow soldering, ensuring reliable connections on the circuit board.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed operation and low power consumption.

Technical Specifications

Clock Drivers & Buffers MC100EL11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

100EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.385 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EL11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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