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MC100E310FNR2G

Onsemi

MC100E310FNR2G by Onsemi

MC100E310FNR2G clock driver by Onsemi features 0.8 ns propagation delay, 5V nominal voltage, and 700 MHz min fmax. Ideal for industrial applications requiring high-speed signal conditioning with differential mux input and 8 true outputs in a compact chip carrier package.

Median Price

$5.020

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,811 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

12,811

-

$4.990

$4.460

$4.200

Farnell

UK . 12,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.020

10k+ parts

-

12,811

-

-

$5.020

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Verical

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

7,000

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,112 parts In-Stock

1+ parts

$5.282

100+ parts

-

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1,112

$5.282

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Vyrian

USA . 7,270 parts In-Stock

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7,270

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ACDS - Activité Composants Distribution Service

France . 302 parts In-Stock

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302

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Distributors (Availability)

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Corphita

USA . 854 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

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854

$5.004

-

-

-

Corohmni

South Africa . 445 parts In-Stock

1+ parts

$5.020

100+ parts

-

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10k+ parts

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445

$5.020

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-

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Component Stockers USA

USA . 19,053 parts In-Stock

1+ parts

$5.730

100+ parts

$5.380

1k+ parts

$4.860

10k+ parts

$4.860

19,053

$5.730

$5.380

$4.860

$4.860

AZTECH Wire

Italy . 363 parts In-Stock

1+ parts

$20.170

100+ parts

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363

$20.170

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QUARKTWIN TECHNOLOGY LTD

USA . 16,192 parts In-Stock

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16,192

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Continental Prestige Electronics

USA . 12,811 parts In-Stock

1+ parts

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100+ parts

$4.730

1k+ parts

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12,811

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$4.730

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Problanco Electronics

Mexico . 8,276 parts In-Stock

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8,276

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SupplyDigital Components

Austria . 4,502 parts In-Stock

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TANS Electronics

Latvia . 706 parts In-Stock

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706

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Microchip USA

USA . 426 parts In-Stock

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426

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Kulean Microsystems

USA . 415 parts In-Stock

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415

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UHIMA Technologies

Türkiye . 44 parts In-Stock

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44

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Overview

Unlock the potential of your electronic designs with the MC100E310FNR2G clock driver and buffer by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality products that exceed expectations. Designed for precision and reliability, this clock driver offers fast propagation delays and differential mux input conditioning for seamless integration into your applications. Experience the value of improved performance and efficiency with the MC100E310FNR2G, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver/buffer.

Propagation Delay At Nominal Supply: 0.85 ns

Offers fast signal processing and efficient performance.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement compatible with most electronic systems.

Power Supplies (V): +-5

Provides balanced power input for stable operation.

No. of Terminals: 28

Offers versatility in connecting to other components in the system.

Propagation Delay (tpd): 0.8 ns

Further emphasizes fast signal processing capabilities.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in low temperature environments.

Width: 11.505 mm

Compact size for easy integration into various electronic devices.

Technical Specifications

Clock Drivers & Buffers MC100E310FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V

Family:

100E

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Minimum fmax:

700 MHz

Trade Compliance

MC100E310FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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