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LC75850W

Onsemi

LC75850W by Onsemi

LC75850W by Onsemi is a 64-terminal CMOS IC with 52 segments for industrial applications. It operates b/w -40 to 85 °C, drawing a max current of 1.3mA at 4.5/8.0V supply, suitable for segment display mode in various electronic devices.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Cyclops Electronics Ltd

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Digiode

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Kulean Microsystems

USA . 7,908 parts In-Stock

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TANS Electronics

Latvia . 7,628 parts In-Stock

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Problanco Electronics

Mexico . 7,468 parts In-Stock

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SupplyDigital Components

Austria . 4,611 parts In-Stock

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Corphita

USA . 1,647 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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Corohmni

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Overview

Revolutionize your display systems with the LC75850W by Onsemi, a top-of-the-line Other Function Interface IC that offers unmatched quality and reliability. With Onsemi's reputation for excellence in manufacturing, this product delivers exceptional performance and durability. Ideal for a variety of applications, this IC provides seamless integration and precise control, making it a valuable investment for customers seeking superior functionality. Upgrade your display solutions today with the LC75850W and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuits inside, ensuring long-term reliability.

Display Mode: SEGMENT

Segment display provides clear and easy-to-read information for users.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Power Supplies (V): 4.5/8.0

Supports a range of power supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square shape allows for compact design and efficient use of space.

No. of Terminals: 64

Provides a sufficient number of connection points for versatile connectivity options.

Package Style (Meter): FLATPACK

Flatpack design makes it easy to integrate into electronic devices and systems.

No. of Backplanes: 3-BP

Having 3 backplanes allows for more complex circuit configurations and functions.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide efficient soldering and secure connections.

Maximum Supply Current: 1.3 mA

Low supply current requirement helps in efficient power management.

No. of Segments: 52

Having 52 segments allows for displaying a wide range of information and data.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and space-saving design.

Technical Specifications

Other Function Interface ICs LC75850W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G64

No. of Backplanes:

3-BP

No. of Segments:

52

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

4.5/8.0

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1.3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75850W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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