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LC75838W

Onsemi

LC75838W by Onsemi

LC75838W by Onsemi is a CMOS IC with 40 segments, suitable for industrial applications. It operates b/w -40 to 85 °C, with power supplies of 3/5V. This surface-mount device has a flatpack style and quad terminal position, making it ideal for segment display mode in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 731 parts In-Stock

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Digiode

USA . 610 parts In-Stock

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610

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SupplyDigital Components

Austria . 6,320 parts In-Stock

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TANS Electronics

Latvia . 3,047 parts In-Stock

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Kulean Microsystems

USA . 2,856 parts In-Stock

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Corphita

USA . 1,707 parts In-Stock

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Problanco Electronics

Mexico . 1,244 parts In-Stock

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UHIMA Technologies

Türkiye . 843 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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Overview

Discover the LC75838W by Onsemi, a top-quality Other Function Interface IC designed to elevate your electronic applications. With a strong reputation for excellence, Onsemi delivers reliable products that meet industry standards. The LC75838W is perfect for a variety of applications, offering seamless integration and superior performance. Experience the value of precision engineering and cutting-edge technology with this versatile solution. Elevate your projects with the LC75838W and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC, making it suitable for industrial applications.

Display Mode: SEGMENT

Segment display mode offers clear and readable output, which is essential for various function interface applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape allows for efficient placement on the board and better utilization of space within the design.

Power Supplies (V): 3/5

The dual power supply options provide flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 64

Having 64 terminals allows for a wide range of connectivity options and functionalities within the IC.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and low-profile design, suitable for space-constrained applications.

No. of Backplanes: 8/10-BP

With 8/10 backplanes, this IC can handle multiple input/output channels efficiently, enhancing its functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for harsh industrial environments where temperature fluctuations can occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold conditions, increasing the versatility of this IC.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and facilitates efficient circuit board layout.

Temperature Grade: INDUSTRIAL

Being industrial-grade means that this IC can withstand rugged conditions and provide reliable performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and reliable connections, ensuring a robust interface for the IC.

No. of Segments: 40

With 40 segments, this IC can display a wide range of information and graphics, enhancing its usability for various applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and precise placement on the circuit board, optimizing space usage.

Technical Specifications

Other Function Interface ICs LC75838W attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G64

No. of Backplanes:

8/10-BP

No. of Segments:

40

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75838W Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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