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LC75813ES-E

Onsemi

LC75813ES-E by Onsemi

LC75813ES-E by Onsemi is a CMOS IC with 87 segments, operating at -40 to 85 °C. It has 100 terminals, quad position, and Gull Wing form factor. Suitable for industrial applications requiring a segment display mode and power supplies of 3/5V.

Median Price

$6.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,250 parts In-Stock

1+ parts

-

100+ parts

$5.270

1k+ parts

$4.720

10k+ parts

$4.440

18,250

-

$5.270

$4.720

$4.440

DigiKey

USA . 18,250 parts In-Stock

1+ parts

-

100+ parts

$6.100

1k+ parts

-

10k+ parts

-

18,250

-

$6.100

-

-

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$6.588

1k+ parts

$5.900

10k+ parts

$5.550

18,000

-

$6.588

$5.900

$5.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,767 parts In-Stock

1+ parts

$5.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,767

$5.060

-

-

-

Digiode

USA . 1,697 parts In-Stock

1+ parts

$5.576

100+ parts

-

1k+ parts

-

10k+ parts

-

1,697

$5.576

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 194 parts In-Stock

1+ parts

$5.060

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$5.060

-

-

-

Corphita

USA . 963 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

-

10k+ parts

-

963

$5.283

-

-

-

Continental Prestige Electronics

USA . 18,250 parts In-Stock

1+ parts

-

100+ parts

$5.060

1k+ parts

-

10k+ parts

-

18,250

-

$5.060

-

-

TANS Electronics

Latvia . 6,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,108

-

-

-

-

SupplyDigital Components

Austria . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,503

-

-

-

-

Kulean Microsystems

USA . 1,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,809

-

-

-

-

Problanco Electronics

Mexico . 1,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

-

-

-

-

UHIMA Technologies

Türkiye . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Kepictronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Microchip USA

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Overview

Discover the LC75813ES-E by Onsemi, a top-quality Other Function Interface IC designed to elevate your electronic projects. With Onsemi's reputation for excellence in manufacturing, this product guarantees reliability and durability. Ideal for a wide range of applications, this IC offers unmatched value with its versatility and performance. Experience the benefits of seamless integration, efficient power supplies, and easy installation. Upgrade your projects with the LC75813ES-E and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for various environments.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read information display, suitable for a variety of applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different devices.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and functionality in the system.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact and space-saving design, ideal for applications with limited space availability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for versatile use in both cold and hot environments.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and corrosion resistance for long-term reliability.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance, making the IC energy-efficient and responsive.

Technical Specifications

Other Function Interface ICs LC75813ES-E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

3/4-BP

No. of Segments:

87

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC75813ES-E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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