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ISO7741QDBQQ1

Texas Instruments

ISO7741QDBQQ1 by Texas Instruments

ISO7741QDBQQ1 by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it ideal for automotive applications requiring AEC-Q100 screening. The small outline package with dual terminals and nickel/palladium/gold finish ensures reliability in harsh environments.

Median Price

$3.165

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,165 parts In-Stock

1+ parts

$3.165

100+ parts

$2.614

1k+ parts

$1.413

10k+ parts

-

1,165

$3.165

$2.614

$1.413

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Mouser Electronics

USA . 167 parts In-Stock

1+ parts

$3.910

100+ parts

$3.140

1k+ parts

$2.980

10k+ parts

$2.510

167

$3.910

$3.140

$2.980

$2.510

Arrow

USA . 750 parts In-Stock

1+ parts

-

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$2.413

1k+ parts

$1.907

10k+ parts

$1.720

750

-

$2.413

$1.907

$1.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.480

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300

$2.480

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Digiode

USA . 2,893 parts In-Stock

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$3.007

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2,893

$3.007

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Chip Stock

USA . 17,762 parts In-Stock

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Vyrian

USA . 3,465 parts In-Stock

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Avant Electronics Limited

UK . 55 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 299 parts In-Stock

1+ parts

$2.050

100+ parts

$1.999

1k+ parts

$1.988

10k+ parts

-

299

$2.050

$1.999

$1.988

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Argo Parts USA

USA . 4,190 parts In-Stock

1+ parts

$2.480

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-

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4,190

$2.480

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Continental Prestige Electronics

USA . 3,042 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

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10k+ parts

$2.430

3,042

$2.480

-

-

$2.430

Corphita

USA . 3,004 parts In-Stock

1+ parts

$2.848

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3,004

$2.848

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Ampacity Inc.

Singapore . 150 parts In-Stock

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$4.460

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150

$4.460

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Parana Technologies

USA . 498 parts In-Stock

1+ parts

$8.983

100+ parts

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$9.652

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498

$8.983

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$9.652

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$9.891

100+ parts

$9.100

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1,000

$9.891

$9.100

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ChromeModa Solutions

Germany . 6,449 parts In-Stock

1+ parts

$10.093

100+ parts

$8.276

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6,449

$10.093

$8.276

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

1+ parts

$10.093

100+ parts

$9.588

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$9.084

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1,059

$10.093

$9.588

$9.084

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Corohmni

South Africa . 194 parts In-Stock

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$10.545

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194

$10.545

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$13.535

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$12.858

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$12.858

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10

$13.535

$12.858

$12.858

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QUARKTWIN TECHNOLOGY LTD

USA . 7,717 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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iodParts Technologies Inc.

India . 5,600 parts In-Stock

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Lixinc

USA . 2,447 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$2.430

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$2.356

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$2.306

2,000

-

$2.430

$2.356

$2.306

Robosynatics

Brazil . 204 parts In-Stock

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$0.230

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$0.230

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$0.230

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$0.230

$0.230

Lucentia Tech

USA . 204 parts In-Stock

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$0.230

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$0.230

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$0.230

204

-

$0.230

$0.230

$0.230

Overview

Enhance your automotive applications with the high-quality ISO7741QDBQQ1 by Texas Instruments. This interface circuit IC offers unmatched reliability and performance, thanks to its AEC-Q100 screening level and advanced CMOS technology. With a compact design and dual terminal position, this product boasts 4 functions in one package, making it a versatile and cost-effective solution for your project. Trust Texas Instruments for cutting-edge innovations that deliver value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the integrated circuit inside.

Surface Mount: YES

Being surface mountable makes this product suitable for automated assembly processes, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V allows for versatility in different applications and power requirements.

No. of Functions: 4

With 4 functions integrated into one IC, this product offers increased functionality in a compact design.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that this IC meets automotive industry standards for reliability and performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and orientation on a circuit board, optimizing space efficiency.

No. of Terminals: 16

With 16 terminals, this IC provides multiple connection points for enhanced connectivity and signal transmission.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB and enables higher component density in electronic devices.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage of 2.25V allows for operation in power-constrained environments, extending the range of possible applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this IC suitable for use in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in PCB layout and simplifies the routing of connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm enables a compact profile for space-constrained applications.

Width: 3.895 mm

The narrow width of 3.895mm facilitates efficient placement and routing of components on a circuit board.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand the soldering process during assembly without compromising performance.

Length: 4.905 mm

The short length of 4.905mm contributes to a space-saving design and allows for tighter integration in electronic systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the stringent requirements for temperature range, reliability, and performance in vehicle electronics.

No. of Channels: 4

With 4 channels available, this IC can handle multiple data or signal streams simultaneously, enhancing overall system functionality.

Technology: CMOS

Utilizing CMOS technology guarantees low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and inspection processes during assembly, ensuring consistent and reliable connections.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V offers a standard power level for stable operation and compatibility with common power sources.

Terminal Pitch: 0.635 mm

The tight terminal pitch of 0.635mm allows for high-density mounting and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 2

Having an MSL of 2 indicates that this IC has moderate sensitivity to moisture, suitable for standard soldering processes and environments.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data exchange between different components, essential for system integration.

Technical Specifications

Other Function Interface ICs ISO7741QDBQQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED (VCC2) 2.25-5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7741QDBQQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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