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TXS0108EZXYR

Texas Instruments

TXS0108EZXYR by Texas Instruments

TXS0108EZXYR by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.2-3.6V, ideal for industrial applications. It features a 3-state output and operates b/w -40 to 85°C, making it suitable for various electronic devices. This IC comes in a compact grid array package with very thin profile and fine pitch terminals for easy surface mounting.

Median Price

$4.720

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.230

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-

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50

$1.230

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Tomark Electronics Ltd

UK . 32,558 parts In-Stock

1+ parts

$4.720

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32,558

$4.720

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NAC Semi

USA . 133 parts In-Stock

1+ parts

$7.890

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133

$7.890

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Chip Stock

USA . 13,860 parts In-Stock

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13,860

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Vyrian

USA . 8,110 parts In-Stock

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8,110

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Rebound Electronics

UK . 5,000 parts In-Stock

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5,000

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Bristol Electronics

USA . 2,497 parts In-Stock

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2,497

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Sea View Technologies

USA . 1,377 parts In-Stock

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1,377

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Netsource Technology, Inc.

USA . 795 parts In-Stock

1+ parts

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795

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Cyclops Electronics Ltd

UK . 500 parts In-Stock

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500

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Digiode

USA . 278 parts In-Stock

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278

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LWI Electronics Inc

India . 153 parts In-Stock

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153

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Inventory MP

USA . 125 parts In-Stock

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125

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SPM Sales

USA . 28 parts In-Stock

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28

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J2 Sourcing AB

Sweden . 6 parts In-Stock

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6

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,244 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

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10k+ parts

$1.205

6,244

$1.230

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-

$1.205

Argo Parts USA

USA . 4,418 parts In-Stock

1+ parts

$1.230

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4,418

$1.230

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

$1.169

10k+ parts

$1.144

2,000

$1.230

-

$1.169

$1.144

Modulus Dynamics

Lithuania . 52 parts In-Stock

1+ parts

$1.365

100+ parts

$1.352

1k+ parts

$1.311

10k+ parts

-

52

$1.365

$1.352

$1.311

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$5.744

100+ parts

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737

$5.744

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.341

100+ parts

$6.024

1k+ parts

$6.024

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3,000

$6.341

$6.024

$6.024

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Corohmni

South Africa . 51 parts In-Stock

1+ parts

$10.858

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51

$10.858

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Parana Technologies

USA . 1,215 parts In-Stock

1+ parts

$13.186

100+ parts

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$13.691

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1,215

$13.186

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$13.691

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DigiPath Technology Company

USA . 2,139 parts In-Stock

1+ parts

$14.520

100+ parts

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2,139

$14.520

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ChromeModa Solutions

Germany . 6,720 parts In-Stock

1+ parts

$14.816

100+ parts

$12.149

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6,720

$14.816

$12.149

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IDEA Electronic Components Group

UK . 246 parts In-Stock

1+ parts

$14.816

100+ parts

$14.075

1k+ parts

$13.334

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246

$14.816

$14.075

$13.334

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One Stop Electronics

USA . 1,449 parts In-Stock

1+ parts

$23.500

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1,449

$23.500

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Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$23.500

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430

$23.500

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Semicontronic

India . 1,158 parts In-Stock

1+ parts

$44.500

100+ parts

$43.388

1k+ parts

$43.165

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1,158

$44.500

$43.388

$43.165

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Perfect Parts

USA . 71,901 parts In-Stock

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71,901

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S.R.D Solutions

India . 30,000 parts In-Stock

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Kepictronics

USA . 17,500 parts In-Stock

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17,500

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A-Z Elektronik GmbH

Germany . 11,088 parts In-Stock

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11,088

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

1+ parts

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4,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Corphita

USA . 493 parts In-Stock

1+ parts

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493

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iodParts Technologies Inc.

India . 10 parts In-Stock

1+ parts

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10

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Overview

Discover the innovative TXS0108EZXYR by Texas Instruments, a high-quality interface IC that offers seamless connectivity in various applications. With Texas Instruments' reputation for excellence, this product guarantees reliability and performance. Ideal for industrial use, this 8-bit IC ensures efficient data transmission with its advanced features. Trust in Texas Instruments to provide cutting-edge technology that delivers value and benefits to customers seeking top-notch interface solutions. Choose the TXS0108EZXYR for superior quality and unmatched performance in your electronic projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and versatility in different environments.

Surface Mount

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage

3.6 V - Provides a wide operating range for various applications.

Package Shape

RECTANGULAR - Offers a standard form factor for easy integration into existing designs.

No. of Bits

8 - Offers sufficient data processing capabilities for many functions.

Power Supplies (V)

1.2/3.6,1.8/5 - Accommodates different power supply configurations for flexibility.

No. of Terminals

20 - Provides ample connection points for interfacing with other components.

Package Style (Meter)

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Enables compact and space-saving designs.

Minimum Supply Voltage

1.2 V - Allows for operation in low-power scenarios.

Maximum Operating Temperature

85 °C - Ensures reliable performance in high-temperature environments.

Output Characteristics

3-STATE - Offers flexibility in driving outputs to high impedance.

Minimum Operating Temperature

40 °C - Ensures functionality in extreme cold conditions.

Terminal Finish

TIN SILVER COPPER - Provides a reliable and durable terminal coating for long-term use.

Terminal Position

BOTTOM - Facilitates easy connections in various circuit layouts.

Maximum Seated Height

0.61 mm - Enables low-profile installations in space-constrained applications.

Width

2.5 mm - Contributes to a compact form factor for efficient board layout.

Maximum Time At Peak Reflow Temperature (s)

30 - Supports proper solder reflow during assembly.

Peak Reflow Temperature °C

260 - Ensures proper soldering for reliable connections.

Length

3 mm - Contributes to a compact overall footprint for space-saving designs.

Temperature Grade

INDUSTRIAL - Suitable for use in harsh industrial environments.

Terminal Form

BALL - Facilitates reliable connections during installation.

Maximum Supply Current

0.008 mA - Allows for efficient power consumption in operation.

Nominal Supply Voltage

2.5 V - Provides a stable operating voltage for consistent performance.

Terminal Pitch

0.5 mm - Enables tight integration of components on the circuit board.

Interface IC Type

INTERFACE CIRCUIT - Provides essential functionality for interfacing with other devices.

Technical Specifications

Other Function Interface ICs TXS0108EZXYR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 1.65 TO 5.5 VOLT

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.61 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.008 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

TXS0108EZXYR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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