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TXS0108ENMER

Texas Instruments

TXS0108ENMER by Texas Instruments

TXS0108ENMER by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.4V to 3.6V and operating temperature from -40°C to 85°C. It features a 3-STATE output characteristic, very thin profile package style, and a grid array package shape. Ideal for industrial applications requiring precise signal interfacing in compact spaces.

Median Price

$1.775

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,776 parts In-Stock

1+ parts

$1.270

100+ parts

$1.049

1k+ parts

$0.567

10k+ parts

-

19,776

$1.270

$1.049

$0.567

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DigiKey

USA . 3 parts In-Stock

1+ parts

$2.280

100+ parts

$1.379

1k+ parts

$1.262

10k+ parts

-

3

$2.280

$1.379

$1.262

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.784

100+ parts

-

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-

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200

$0.784

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-

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Digiode

USA . 4,918 parts In-Stock

1+ parts

$1.206

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-

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4,918

$1.206

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Chip Stock

USA . 22,270 parts In-Stock

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22,270

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Vyrian

USA . 10,963 parts In-Stock

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10,963

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Sensible Micro Corp

USA . 4,600 parts In-Stock

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4,600

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Cyclops Electronics Ltd

UK . 2,901 parts In-Stock

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2,901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

$0.737

10k+ parts

-

50

$0.768

-

$0.737

-

Argo Parts USA

USA . 4,006 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

-

10k+ parts

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4,006

$0.784

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-

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Continental Prestige Electronics

USA . 748 parts In-Stock

1+ parts

$0.784

100+ parts

-

1k+ parts

-

10k+ parts

$0.768

748

$0.784

-

-

$0.768

Modulus Dynamics

Lithuania . 58 parts In-Stock

1+ parts

$0.870

100+ parts

$0.861

1k+ parts

$0.835

10k+ parts

-

58

$0.870

$0.861

$0.835

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Ampacity Inc.

Singapore . 11,128 parts In-Stock

1+ parts

$1.080

100+ parts

-

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11,128

$1.080

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Semicontronic

India . 10,663 parts In-Stock

1+ parts

$1.080

100+ parts

$1.053

1k+ parts

$1.048

10k+ parts

-

10,663

$1.080

$1.053

$1.048

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Corphita

USA . 4,671 parts In-Stock

1+ parts

$1.143

100+ parts

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4,671

$1.143

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$2.831

100+ parts

$2.690

1k+ parts

$2.690

10k+ parts

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500

$2.831

$2.690

$2.690

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Parana Technologies

USA . 2,056 parts In-Stock

1+ parts

$5.453

100+ parts

-

1k+ parts

$6.171

10k+ parts

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2,056

$5.453

-

$6.171

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DigiPath Technology Company

USA . 319 parts In-Stock

1+ parts

$6.004

100+ parts

$5.524

1k+ parts

-

10k+ parts

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319

$6.004

$5.524

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ChromeModa Solutions

Germany . 691 parts In-Stock

1+ parts

$6.127

100+ parts

$5.024

1k+ parts

-

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691

$6.127

$5.024

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IDEA Electronic Components Group

UK . 623 parts In-Stock

1+ parts

$6.127

100+ parts

-

1k+ parts

$5.514

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623

$6.127

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$5.514

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Corohmni

South Africa . 1,061 parts In-Stock

1+ parts

$12.445

100+ parts

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1,061

$12.445

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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15,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

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Lixinc

USA . 2,024 parts In-Stock

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2,024

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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100

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Overview

Discover the TXS0108ENMER by Texas Instruments - a top-quality interface IC that brings unmatched reliability and performance to your projects. Made by a trusted manufacturer, this product offers seamless integration and compatibility with various applications in the industry. With its state-of-the-art design and advanced features, customers can expect enhanced functionality and efficiency, making it a valuable addition to any project. Upgrade your systems today with the TXS0108ENMER and experience the difference in quality and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration into circuit boards, saving space and improving overall efficiency.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different setups.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, suitable for tight spaces and efficient board layouts.

No. of Bits: 8

With 8 bits, this product offers sufficient processing power for handling complex functions and tasks.

No. of Terminals: 20

The 20 terminals provide ample connectivity options, enabling seamless integration into various circuit configurations.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch design enhances signal transmission and reduces signal interference.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, enhancing versatility in application usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function reliably even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper as the terminal finish ensures good conductivity, reducing signal loss and improving overall performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and enhances ease of use in circuit board assembly.

Maximum Seated Height: 1.6 mm

The low maximum seated height minimizes the profile of the product, making it suitable for slim devices or applications with height constraints.

Width: 2.5 mm

The compact width dimension allows for space-saving integration, ideal for applications with limited board space.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and component stability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables safe and efficient soldering processes.

Length: 3 mm

The short length dimension of 3 mm offers a small footprint, suitable for compact device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged industrial environments where temperature fluctuations are common.

Terminal Form: BALL

The ball terminal form provides secure connections and ease of soldering, enhancing the overall reliability of the product.

Maximum Supply Current: 0.008 mA

With a low maximum supply current, this product consumes minimal power, making it energy-efficient and cost-effective.

Nominal Supply Voltage: 1.65 V

The nominal supply voltage requirement of 1.65 V ensures compatibility with common power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting, contributing to compact and efficient circuit board layouts.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this product has a moderate level of moisture sensitivity, suitable for standard handling and storage practices.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components or systems, enhancing connectivity and functionality.

Technical Specifications

Other Function Interface ICs TXS0108ENMER attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

.008 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

TXS0108ENMER Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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