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ISO7762FDWR

Texas Instruments

ISO7762FDWR by Texas Instruments

ISO7762FDWR by Texas Instruments is a small outline interface IC with 6 functions and 16 terminals. It operates at temperatures ranging from -55 to 125 °C and has a max supply voltage of 5.5 V. It is commonly used in military applications due to its CMOS technology and gull wing terminal form.

Median Price

$2.028

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,599 parts In-Stock

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$2.028

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$1.777

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$1.004

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$2.028

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Distributors (In-Stock)

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Digiode

USA . 1,610 parts In-Stock

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$1.927

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$1.927

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Nova Conductors

Japan . 200 parts In-Stock

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$2.702

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$2.702

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LIBRA Elektronik GmbH

Germany . 7,447 parts In-Stock

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Vyrian

USA . 7,349 parts In-Stock

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Chip Stock

USA . 5,130 parts In-Stock

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Martec Srl

Italy . 998 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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ComSIT USA

USA . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,354 parts In-Stock

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$1.720

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$1.720

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Semicontronic

India . 7,332 parts In-Stock

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$1.720

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$1.677

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$1.668

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7,332

$1.720

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$1.668

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Corphita

USA . 2,934 parts In-Stock

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$1.825

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Argo Parts USA

USA . 4,068 parts In-Stock

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Continental Prestige Electronics

USA . 2,282 parts In-Stock

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$2.648

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Netroflash

USA . 1,000 parts In-Stock

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$2.702

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$2.567

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$2.513

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$2.702

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$2.513

Corohmni

South Africa . 850 parts In-Stock

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$3.399

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$3.399

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Parana Technologies

USA . 482 parts In-Stock

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$11.044

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$11.502

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482

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$10.683

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$10.683

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DigiPath Technology Company

USA . 691 parts In-Stock

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$12.161

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691

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ChromeModa Solutions

Germany . 1,471 parts In-Stock

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$12.409

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$10.175

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

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$12.409

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$11.789

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$11.168

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Lixinc

USA . 9,214 parts In-Stock

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Futuretech Components

Singapore . 1,980 parts In-Stock

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Overview

Discover the cutting-edge ISO7762FDWR by Texas Instruments, a premier manufacturer renowned for its high-quality products. As a leading supplier of Other Function Interface ICs, Texas Instruments delivers exceptional reliability and performance. This versatile product boasts 6 functions and 6 channels, making it ideal for a wide range of applications. With a compact rectangular package style and a low-profile design, it offers easy integration into any system. Its advanced CMOS technology ensures efficient and accurate signal transmission. Experience the value of this remarkable interface circuit, providing customers with unparalleled benefits, uncompromising quality, and seamless functionality. Don't miss out on the advantages that the ISO7762FDWR brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the IC, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on printed circuit boards, saving valuable space and facilitating mass production.

Maximum Supply Voltage: 5.5V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile and suitable for a variety of system requirements.

No. of Functions: 6

With six functions integrated into a single IC, this product offers efficient functionality, simplifying circuit designs and conserving board space.

Package Shape: RECTANGULAR

The rectangular package shape allows for standardized mounting and compatibility with common board designs, enhancing ease of integration and reducing design constraints.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, accommodating multiple input and output connections, promoting versatility and expanded functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact form factor, enabling easy integration into space-constrained applications, including portable devices and compact electronics.

Minimum Supply Voltage: 2.25V

With a low minimum supply voltage requirement, this IC can operate efficiently even in low-power scenarios, optimizing energy consumption and extending battery life.

Maximum Operating Temperature: 125°C

The high maximum operating temperature tolerance allows this IC to withstand demanding environmental conditions, ensuring reliability and suitability for various industrial applications.

Minimum Operating Temperature: -55°C

The low minimum operating temperature range enables this IC to function reliably in extreme cold environments, making it suitable for applications in harsh climates or freezer conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and promoting long-term performance.

Terminal Position: DUAL

The dual terminal position allows for increased flexibility in circuit design and enables compatibility with different board layouts, making it adaptable to various system configurations.

Maximum Seated Height: 2.65mm

With a low maximum seated height, this IC can fit in compact spaces without obstructing adjacent components, promoting efficient use of board real estate.

Width: 7.5mm

The narrow width of this IC contributes to space-saving PCB designs, enabling greater component density and facilitating miniaturization in tight applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering during manufacturing processes, guaranteeing reliable connections and minimizing assembly defects.

Length: 10.3mm

The moderate length of this IC allows for efficient utilization of available board space, accommodating necessary circuitry while maintaining a manageable form factor.

Temperature Grade: MILITARY

The military-grade temperature rating signifies the IC's ability to withstand challenging operating conditions, such as extreme temperature fluctuations or rugged environments.

No. of Channels: 6

With six channels, this IC provides multiple communication paths or signal processing capabilities, offering enhanced system performance and facilitating multi-channel applications.

Technology: CMOS

Built on complementary metal-oxide-semiconductor (CMOS) technology, this IC offers low power consumption, high noise immunity, and compatibility with various digital logic systems.

Terminal Form: GULL WING

The gull-wing terminal form allows for reliable SMT soldering, ensuring secure connections and enabling automated assembly processes, optimizing production efficiency.

Nominal Supply Voltage: 2.5V

The nominal supply voltage specifies the standard operating voltage, offering compatibility with common power sources and simplifying integration into various system designs.

Terminal Pitch: 1.27mm

The narrow terminal pitch ensures precise alignment and convenient mounting on standard PCBs, promoting compatibility with existing board layouts and facilitating manufacturing processes.

Moisture Sensitivity Level (MSL): 2

With an MSL rating of 2, this IC can withstand moderate levels of moisture exposure during storage and handling, providing stability and longevity in typical operating environments.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC facilitates communication and data transfer between different subsystems or devices, enhancing interoperability and enabling seamless integration within complex systems.

Technical Specifications

Other Function Interface ICs ISO7762FDWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7762FDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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