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ISO7231CDWRG4

Texas Instruments

ISO7231CDWRG4 by Texas Instruments

ISO7231CDWRG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating at -40 to 125°C. It has a CMOS technology, suitable for automotive applications with a supply voltage range of 3.3V to 5V. The package style is small outline, surface mountable and features nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 36,090 parts In-Stock

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Vyrian

USA . 4,100 parts In-Stock

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Digiode

USA . 2,225 parts In-Stock

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2,225

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Cyclops Electronics Ltd

UK . 9 parts In-Stock

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9

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One Stop Electronics

USA . 1,632 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 362 parts In-Stock

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$5.334

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$5.991

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362

$5.334

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$5.991

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

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$5.993

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$4.914

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$5.993

$4.914

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

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$5.993

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$5.394

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Corohmni

South Africa . 82 parts In-Stock

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$9.235

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$9.235

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AZTECH Wire

Italy . 341 parts In-Stock

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$12.442

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$12.766

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$12.128

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Ampacity Inc.

Singapore . 1,182 parts In-Stock

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$41.500

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Argo Parts USA

USA . 4,539 parts In-Stock

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Continental Prestige Electronics

USA . 2,902 parts In-Stock

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DigiPath Technology Company

USA . 1,749 parts In-Stock

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$5.403

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Corphita

USA . 375 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Modulus Dynamics

Lithuania . 15 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlocking new possibilities in interface circuitry, the Texas Instruments ISO7231CDWRG4 is a game-changer in the world of Other Function Interface ICs. With a maximum supply voltage of 5V and three functions packed into its compact rectangular package, this innovative solution delivers unparalleled quality and reliability. From automotive applications to industrial automation, this product offers customers unmatched value, benefits, and advantages that will elevate their projects to new heights. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and enabling automated assembly.

Maximum Supply Voltage: 5 V

With a maximum supply voltage of 5V, this product is compatible with a wide range of systems and applications.

No. of Functions: 3

Having multiple functions in a single IC reduces component count, saves space, and simplifies circuit design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can perform reliably in extreme conditions.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring high reliability and performance in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function Interface ICs ISO7231CDWRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 5 V FOR NORMAL OPERATION

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7231CDWRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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