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ISO7741FDBQ

Texas Instruments

ISO7741FDBQ by Texas Instruments

ISO7741FDBQ by Texas Instruments is a 4-channel interface IC with a supply voltage range of 2.25V to 5.5V. It has a small outline package style and is suitable for military-grade applications.

Median Price

$3.374

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,112 parts In-Stock

1+ parts

$3.037

100+ parts

$2.509

1k+ parts

$1.356

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21,112

$3.037

$2.509

$1.356

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Mouser Electronics

USA . 8,194 parts In-Stock

1+ parts

$3.710

100+ parts

$3.610

1k+ parts

$3.500

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8,194

$3.710

$3.610

$3.500

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.034

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-

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10

$2.034

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Digiode

USA . 4,470 parts In-Stock

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$2.885

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4,470

$2.885

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 9,523 parts In-Stock

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ComSIT Distribution GmbH

Germany . 493 parts In-Stock

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493

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,114 parts In-Stock

1+ parts

$2.034

100+ parts

-

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4,114

$2.034

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Continental Prestige Electronics

USA . 3,994 parts In-Stock

1+ parts

$2.034

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-

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$1.993

3,994

$2.034

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-

$1.993

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.034

100+ parts

-

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$1.932

10k+ parts

$1.892

2,000

$2.034

-

$1.932

$1.892

Modulus Dynamics

Lithuania . 30 parts In-Stock

1+ parts

$2.258

100+ parts

$2.235

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$2.167

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30

$2.258

$2.235

$2.167

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Ampacity Inc.

Singapore . 9,600 parts In-Stock

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$2.580

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9,600

$2.580

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Semicontronic

India . 9,479 parts In-Stock

1+ parts

$2.580

100+ parts

$2.516

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$2.503

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9,479

$2.580

$2.516

$2.503

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Corphita

USA . 2,437 parts In-Stock

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$2.733

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2,437

$2.733

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Parana Technologies

USA . 152 parts In-Stock

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$7.273

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$7.773

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152

$7.273

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$7.773

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DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

$8.009

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$7.368

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2,247

$8.009

$7.368

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Advanced Electronics

New Zealand . 17 parts In-Stock

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$8.048

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$7.646

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$7.646

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17

$8.048

$7.646

$7.646

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ChromeModa Solutions

Germany . 4,296 parts In-Stock

1+ parts

$8.172

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$6.701

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4,296

$8.172

$6.701

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

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$8.172

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$7.355

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1,143

$8.172

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Corohmni

South Africa . 1,009 parts In-Stock

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$8.779

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$8.779

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Lixinc

USA . 12,726 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$2.302

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$2.302

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$2.302

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$2.302

$2.302

$2.302

Computer Components Inc. - USA

USA . 5 parts In-Stock

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Overview

Discover the ISO7741FDBQ, a high-quality interface IC manufactured by Texas Instruments. With its compact rectangular shape and dual terminal position, this versatile IC offers 4 functions and 4 channels, making it suitable for a wide range of applications. Experience the benefits of this product's small outline, shrink pitch package style, providing maximum seated height of just 1.75mm. With a wide operating temperature range and military-grade technology, the ISO7741FDBQ guarantees reliability and durability. Trust in Texas Instruments' expertise and choose this interface circuit for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and soldering onto printed circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this IC can handle a wide range of power input levels, increasing its versatility in different systems.

No. of Functions: 4

Having 4 functions in a single IC reduces the need for multiple components, saving space and simplifying the design of the overall system.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on a PCB and easy placement within the system layout.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components, enhancing the IC's functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB and allows for dense component placement, ideal for compact electronic devices.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures compatibility with various power sources and extends the operating range of the IC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable performance in harsh environments and during temperature fluctuations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish provides excellent conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB mounting options and facilitates efficient routing of signals.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables a compact and slim profile for the IC, making it suitable for space-constrained applications.

Width: 3.895 mm

Narrow width of 3.895mm contributes to space-saving design and allows for high-density PCB layouts.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures proper soldering during assembly and enhances overall reliability.

Length: 4.905 mm

Compact length of 4.905mm facilitates easy integration into electronic systems with limited space available.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and performance under extreme conditions, making this IC suitable for demanding applications.

No. of Channels: 4

Having 4 channels allows for multiple input/output paths, enhancing the IC's capability to handle complex signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability during PCB assembly and offers ease of inspection and rework if needed.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5V ensures compatibility with standard power sources and enables easy integration into existing systems.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635mm allows for high-density mounting and reliable connections on the PCB, enhancing overall system performance.

Moisture Sensitivity Level (MSL): 2

MSL 2 classification indicates moderate sensitivity to moisture, allowing for safe storage and handling under typical humidity conditions.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication and data exchange between different components in an electronic system, enabling seamless operation.

Technical Specifications

Other Function Interface ICs ISO7741FDBQ attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7741FDBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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