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ISO7741FDW

Texas Instruments

ISO7741FDW by Texas Instruments

ISO7741FDW by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It features a supply voltage range of 2.25-5.5 V and uses CMOS technology. Ideal for military-grade applications requiring interface circuitry in compact spaces.

Median Price

$3.679

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 671 parts In-Stock

1+ parts

$3.468

100+ parts

$2.864

1k+ parts

$1.548

10k+ parts

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671

$3.468

$2.864

$1.548

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Mouser Electronics

USA . 6,543 parts In-Stock

1+ parts

$3.890

100+ parts

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$2.090

10k+ parts

$2.060

6,543

$3.890

-

$2.090

$2.060

DigiKey

USA . 842 parts In-Stock

1+ parts

$4.360

100+ parts

$2.930

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$2.524

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842

$4.360

$2.930

$2.524

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Arrow

USA . 120 parts In-Stock

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$1.959

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$1.896

120

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$1.959

$1.896

Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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$2.322

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75

$2.322

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Digiode

USA . 4,339 parts In-Stock

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$3.295

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4,339

$3.295

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Chip Stock

USA . 45,500 parts In-Stock

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45,500

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Vyrian

USA . 1,963 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,015 parts In-Stock

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Bristol Electronics

USA . 349 parts In-Stock

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349

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,875 parts In-Stock

1+ parts

$1.670

100+ parts

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1,875

$1.670

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Semicontronic

India . 1,728 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

1k+ parts

$1.620

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1,728

$1.670

$1.628

$1.620

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Argo Parts USA

USA . 3,352 parts In-Stock

1+ parts

$2.320

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$2.320

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Continental Prestige Electronics

USA . 1,589 parts In-Stock

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$2.320

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$2.274

1,589

$2.320

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$2.274

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.322

100+ parts

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$2.206

10k+ parts

$2.159

1,000

$2.322

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$2.206

$2.159

Corohmni

South Africa . 301 parts In-Stock

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$2.477

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301

$2.477

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Advanced Electronics

New Zealand . 315 parts In-Stock

1+ parts

$2.551

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$2.424

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$2.424

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315

$2.551

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$2.424

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Corphita

USA . 3,148 parts In-Stock

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$3.121

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Parana Technologies

USA . 397 parts In-Stock

1+ parts

$7.505

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$8.010

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397

$7.505

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$8.010

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ChromeModa Solutions

Germany . 3,005 parts In-Stock

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$8.433

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$6.915

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3,005

$8.433

$6.915

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IDEA Electronic Components Group

UK . 2,105 parts In-Stock

1+ parts

$8.433

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$8.011

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$7.590

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2,105

$8.433

$8.011

$7.590

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Perfect Parts

USA . 44,800 parts In-Stock

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Lixinc

USA . 14,051 parts In-Stock

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Futuretech Components

Singapore . 8,219 parts In-Stock

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Robosynatics

Brazil . 2,056 parts In-Stock

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Lucentia Tech

USA . 2,056 parts In-Stock

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$3.176

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$3.176

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$3.176

2,056

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$3.176

$3.176

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 217 parts In-Stock

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$7.603

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217

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$7.603

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Overview

Elevate your projects with the Texas Instruments ISO7741FDW, a top-of-the-line Interface IC designed to deliver unmatched performance and reliability. With Texas Instruments' renowned quality and expertise in electronic components, this product offers unparalleled value and benefits to customers across various applications. Whether you're working on industrial automation, automotive systems, or consumer electronics, the ISO7741FDW provides the perfect solution with its advanced technology and robust design. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and easy handling.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it versatile for different applications.

No. of Functions: 4

Multiple functions in one IC provide cost and space efficiency in circuit design.

Package Shape: RECTANGULAR

Compact shape fits well in tight spaces on circuit boards.

No. of Terminals: 16

Sufficient terminals for connecting various components and signals.

Package Style (Meter): SMALL OUTLINE

Space-saving design for efficient PCB layout.

Minimum Supply Voltage: 2.25 V

Can operate at low voltage levels, conserving power.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Operational in extreme cold conditions, broadening its usability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good conductivity and long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB mounting options.

Maximum Seated Height: 2.65 mm

Low profile design for compact electronic devices.

Width: 7.5 mm

Narrow width saves space on the PCB.

Peak Reflow Temperature °C: 260

Can withstand high temperature soldering processes without damage.

Length: 10.3 mm

Compact length for efficient PCB layout.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and durability.

No. of Channels: 4

Multiple channels for handling different signals or data streams simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection to the PCB.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB assembly.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level allows for standard PCB storage and handling.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing different components or systems, offering versatile connectivity options.

Technical Specifications

Other Function Interface ICs ISO7741FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7741FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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