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ISO7763FDBQR

Texas Instruments

ISO7763FDBQR by Texas Instruments

ISO7763FDBQR by Texas Instruments is a 16-terminal IC with 6 functions. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5 V, it's ideal for interface circuits in compact designs.

Median Price

$1.947

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 39,775 parts In-Stock

1+ parts

$1.947

100+ parts

$1.608

1k+ parts

$0.869

10k+ parts

-

39,775

$1.947

$1.608

$0.869

-

Mouser Electronics

USA . 1,403 parts In-Stock

1+ parts

$3.350

100+ parts

$2.080

1k+ parts

$1.850

10k+ parts

$1.780

1,403

$3.350

$2.080

$1.850

$1.780

DigiKey

USA . 3,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.753

3,393

-

-

-

$1.753

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,170 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,170

$1.850

-

-

-

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$2.220

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$2.220

-

-

-

Vyrian

USA . 13,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,768

-

-

-

-

Chip Stock

USA . 8,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,700

-

-

-

-

Bristol Electronics

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,743 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

-

13,743

$1.650

-

-

-

Semicontronic

India . 13,681 parts In-Stock

1+ parts

$1.650

100+ parts

$1.609

1k+ parts

$1.600

10k+ parts

-

13,681

$1.650

$1.609

$1.600

-

Corphita

USA . 3,773 parts In-Stock

1+ parts

$1.752

100+ parts

-

1k+ parts

-

10k+ parts

-

3,773

$1.752

-

-

-

Argo Parts USA

USA . 3,889 parts In-Stock

1+ parts

$2.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3,889

$2.220

-

-

-

Continental Prestige Electronics

USA . 3,877 parts In-Stock

1+ parts

$2.220

100+ parts

-

1k+ parts

-

10k+ parts

$2.176

3,877

$2.220

-

-

$2.176

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.220

100+ parts

$2.176

1k+ parts

-

10k+ parts

-

100

$2.220

$2.176

-

-

Corohmni

South Africa . 161 parts In-Stock

1+ parts

$2.280

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$2.280

-

-

-

Advanced Electronics

New Zealand . 51 parts In-Stock

1+ parts

$2.348

100+ parts

$2.231

1k+ parts

$2.231

10k+ parts

-

51

$2.348

$2.231

$2.231

-

Modulus Dynamics

Lithuania . 600 parts In-Stock

1+ parts

$2.464

100+ parts

$2.440

1k+ parts

$2.366

10k+ parts

-

600

$2.464

$2.440

$2.366

-

Parana Technologies

USA . 1,818 parts In-Stock

1+ parts

$7.740

100+ parts

-

1k+ parts

$8.274

10k+ parts

-

1,818

$7.740

-

$8.274

-

DigiPath Technology Company

USA . 803 parts In-Stock

1+ parts

$8.523

100+ parts

$7.841

1k+ parts

-

10k+ parts

-

803

$8.523

$7.841

-

-

IDEA Electronic Components Group

UK . 1,257 parts In-Stock

1+ parts

$8.697

100+ parts

$8.262

1k+ parts

$7.827

10k+ parts

-

1,257

$8.697

$8.262

$7.827

-

ChromeModa Solutions

Germany . 245 parts In-Stock

1+ parts

$8.697

100+ parts

$7.132

1k+ parts

-

10k+ parts

-

245

$8.697

$7.132

-

-

Lixinc

USA . 744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

744

-

-

-

-

Overview

Unlock the power of seamless interface integration with the Texas Instruments ISO7763FDBQR. Crafted with precision and reliability in mind, this innovative product offers unparalleled quality and performance. Ideal for a wide range of applications, this interface IC provides customers with a reliable solution that enhances efficiency and functionality. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the ISO7763FDBQR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

Can support high voltage requirements, making it versatile for various applications.

No. of Functions: 6

Provides multiple functions in a single IC, optimizing space and reducing the need for multiple components.

Package Shape: RECTANGULAR

Easily fits into standard circuit board layouts for streamlined design.

No. of Terminals: 16

Offers ample connection points for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design saves space on the circuit board, ideal for applications with size constraints.

Minimum Supply Voltage: 2.25 V

Can operate at low voltages, making it energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability in various operating environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Offers flexibility in mounting and connection options for different applications.

Maximum Seated Height: 1.75 mm

Low profile design for space-saving and compact installations.

Width: 3.895 mm

Compact width for efficient use of space on the circuit board.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during installation without damage.

Length: 4.905 mm

Compact length for space-saving on the circuit board.

Temperature Grade: MILITARY

Designed to meet military-grade specifications for reliability and durability in harsh environments.

No. of Channels: 6

Multiple channels provide versatility in interfacing with different components or systems.

Technology: CMOS

CMOS technology offers low power consumption and fast operation for efficient performance.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during installation.

Nominal Supply Voltage: 2.5 V

Standard voltage for compatibility with a wide range of systems and components.

Terminal Pitch: 0.635 mm

Fine terminal pitch for precise connections and compact design.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates resistance to moisture, ensuring reliability in various environmental conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, making it a reliable choice for communication and control applications.

Technical Specifications

Other Function Interface ICs ISO7763FDBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7763FDBQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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