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ISO7740FDBQ

Texas Instruments

ISO7740FDBQ by Texas Instruments

ISO7740FDBQ by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125°C. It has a supply voltage range of 2.25-5.5V and uses CMOS technology. Ideal for military applications requiring small outline packaging and dual terminal position with nickel/palladium/gold finish.

Median Price

$3.398

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,723 parts In-Stock

1+ parts

$3.037

100+ parts

$2.509

1k+ parts

$1.356

10k+ parts

-

2,723

$3.037

$2.509

$1.356

-

Mouser Electronics

USA . 7,404 parts In-Stock

1+ parts

$3.760

100+ parts

$2.390

1k+ parts

$1.930

10k+ parts

-

7,404

$3.760

$2.390

$1.930

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2.034

-

-

-

Digiode

USA . 2,113 parts In-Stock

1+ parts

$2.885

100+ parts

-

1k+ parts

-

10k+ parts

-

2,113

$2.885

-

-

-

Chip Stock

USA . 5,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,254

-

-

-

-

Vyrian

USA . 3,551 parts In-Stock

1+ parts

-

100+ parts

-

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3,551

-

-

-

-

Cyclops Electronics Ltd

UK . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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133

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.993

100+ parts

-

1k+ parts

$1.914

10k+ parts

-

100

$1.993

-

$1.914

-

Continental Prestige Electronics

USA . 6,665 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

$1.993

6,665

$2.034

-

-

$1.993

Argo Parts USA

USA . 4,290 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

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4,290

$2.034

-

-

-

Ampacity Inc.

Singapore . 3,628 parts In-Stock

1+ parts

$2.580

100+ parts

-

1k+ parts

-

10k+ parts

-

3,628

$2.580

-

-

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Semicontronic

India . 3,296 parts In-Stock

1+ parts

$2.580

100+ parts

$2.516

1k+ parts

$2.503

10k+ parts

-

3,296

$2.580

$2.516

$2.503

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Corphita

USA . 2,618 parts In-Stock

1+ parts

$2.733

100+ parts

-

1k+ parts

-

10k+ parts

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2,618

$2.733

-

-

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$5.170

100+ parts

-

1k+ parts

$5.771

10k+ parts

-

2,168

$5.170

-

$5.771

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ChromeModa Solutions

Germany . 3,265 parts In-Stock

1+ parts

$5.809

100+ parts

$4.763

1k+ parts

-

10k+ parts

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3,265

$5.809

$4.763

-

-

IDEA Electronic Components Group

UK . 2,294 parts In-Stock

1+ parts

$5.809

100+ parts

-

1k+ parts

$5.228

10k+ parts

-

2,294

$5.809

-

$5.228

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Corohmni

South Africa . 10 parts In-Stock

1+ parts

$9.997

100+ parts

-

1k+ parts

-

10k+ parts

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10

$9.997

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$12.077

100+ parts

$11.473

1k+ parts

$11.473

10k+ parts

-

200

$12.077

$11.473

$11.473

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DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

$5.237

1k+ parts

-

10k+ parts

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1,378

-

$5.237

-

-

Lixinc

USA . 756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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756

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Overview

Upgrade your electronics with the ISO7740FDBQ by Texas Instruments, a top-quality Other Function Interface IC offering unmatched performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product ensures seamless integration and superior functionality in a wide range of applications. Experience the value and benefits of cutting-edge technology with the ISO7740FDBQ, providing customers with unparalleled advantages and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in usage.

No. of Functions: 4

Having multiple functions in one IC reduces the need for multiple components, saving space on the PCB and simplifying the design.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to work with, fitting well within standard PCB layouts and facilitating assembly.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connectivity options, accommodating various circuit configurations.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures operation in systems with limited power availability, enhancing compatibility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature indicates resilience to heat, making the IC suitable for demanding industrial environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable performance in cold conditions, expanding the range of application environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish improves conductivity and durability, ensuring stable electrical connections over time.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, enhancing reliability and ease of installation.

Width: 3.895 mm

Compact width saves space on the PCB, allowing for denser and more efficient circuit layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust soldering joints during assembly, contributing to the overall reliability of the product.

Temperature Grade: MILITARY

Military-grade temperature specifications demonstrate high performance and durability, suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting on the PCB and facilitates automated assembly processes, ensuring consistent quality.

Nominal Supply Voltage: 2.5 V

The specified nominal supply voltage serves as a reference point for optimal performance, ensuring stable operation within the recommended range.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting, enabling intricate circuit designs and saving valuable board space.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface circuit design ensures seamless communication and compatibility between different system components, enhancing overall functionality.

Technical Specifications

Other Function Interface ICs ISO7740FDBQ attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7740FDBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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