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ISOW7741BDFMR

Texas Instruments

ISOW7741BDFMR by Texas Instruments

ISOW7741BDFMR by Texas Instruments is a 20-terminal interface IC with 4 functions, operating b/w -40°C to 125°C. It features a max supply voltage of 3.63V and min of 2.97V, suitable for applications requiring small outline packages and dual terminal positions. Ideal for systems needing reliable signal isolation and interface circuitry in compact designs.

Median Price

$8.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,174 parts In-Stock

1+ parts

$7.360

100+ parts

$6.000

1k+ parts

$4.000

10k+ parts

-

10,174

$7.360

$6.000

$4.000

-

Mouser Electronics

USA . 373 parts In-Stock

1+ parts

$8.120

100+ parts

$5.300

1k+ parts

$4.730

10k+ parts

$4.610

373

$8.120

$5.300

$4.730

$4.610

DigiKey

USA . 1,670 parts In-Stock

1+ parts

$8.190

100+ parts

$5.367

1k+ parts

$5.236

10k+ parts

-

1,670

$8.190

$5.367

$5.236

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$6.000

-

-

-

Digiode

USA . 386 parts In-Stock

1+ parts

$6.992

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$6.992

-

-

-

Vyrian

USA . 6,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,412 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

-

10k+ parts

-

6,412

$4.630

-

-

-

Semicontronic

India . 6,339 parts In-Stock

1+ parts

$4.630

100+ parts

$4.514

1k+ parts

$4.491

10k+ parts

-

6,339

$4.630

$4.514

$4.491

-

Advanced Electronics

New Zealand . 18 parts In-Stock

1+ parts

$4.638

100+ parts

$4.406

1k+ parts

$4.406

10k+ parts

-

18

$4.638

$4.406

$4.406

-

Continental Prestige Electronics

USA . 5,341 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

$5.880

5,341

$6.000

-

-

$5.880

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

$5.700

10k+ parts

$5.580

50

$6.000

-

$5.700

$5.580

Corphita

USA . 4,014 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

4,014

$6.624

-

-

-

Corohmni

South Africa . 294 parts In-Stock

1+ parts

$7.208

100+ parts

-

1k+ parts

-

10k+ parts

-

294

$7.208

-

-

-

Parana Technologies

USA . 1,340 parts In-Stock

1+ parts

$13.175

100+ parts

-

1k+ parts

$13.680

10k+ parts

-

1,340

$13.175

-

$13.680

-

IDEA Electronic Components Group

UK . 144 parts In-Stock

1+ parts

$14.803

100+ parts

$14.063

1k+ parts

$13.323

10k+ parts

-

144

$14.803

$14.063

$13.323

-

ChromeModa Solutions

Germany . 107 parts In-Stock

1+ parts

$14.803

100+ parts

$12.138

1k+ parts

-

10k+ parts

-

107

$14.803

$12.138

-

-

DigiPath Technology Company

USA . 2,259 parts In-Stock

1+ parts

-

100+ parts

$13.346

1k+ parts

-

10k+ parts

-

2,259

-

$13.346

-

-

Argo Parts USA

USA . 912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

912

-

-

-

-

Overview

Experience superior quality and reliability with the Texas Instruments ISOW7741BDFMR, a cutting-edge interface circuit designed to meet your diverse application needs. As a trusted manufacturer, Texas Instruments delivers innovative solutions for various industries, ensuring seamless integration and enhanced performance. Perfect for a wide range of functions, this IC offers unparalleled value and benefits, making it the ideal choice for customers seeking top-notch quality and efficiency in their projects. Elevate your designs with the ISOW7741BDFMR and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Maximum Supply Voltage: 3.63 V

Allows for compatibility with a wide range of power sources, increasing flexibility in usage.

No. of Functions: 4

Offers multiple functions within a single IC, reducing the need for additional components and simplifying circuit design.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme temperature environments, making it suitable for various applications.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage, enhancing the IC's reliability in humid conditions.

Technical Specifications

Other Function Interface ICs ISOW7741BDFMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.83 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ISOW7741BDFMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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