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ISOW7741DFMR

Texas Instruments

ISOW7741DFMR by Texas Instruments

ISOW7741DFMR by Texas Instruments is a 20-terminal interface IC with 4 functions. It operates b/w -40 to 125°C, ideal for automotive applications. With a supply voltage range of 2.97-3.63V and surface-mount capability, it offers reliable performance in compact designs.

Median Price

$8.592

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,279 parts In-Stock

1+ parts

$8.464

100+ parts

$6.900

1k+ parts

$4.600

10k+ parts

-

6,279

$8.464

$6.900

$4.600

-

Mouser Electronics

USA . 1,119 parts In-Stock

1+ parts

$8.720

100+ parts

$5.730

1k+ parts

$5.140

10k+ parts

-

1,119

$8.720

$5.730

$5.140

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DigiKey

USA . 1,332 parts In-Stock

1+ parts

$8.850

100+ parts

$5.833

1k+ parts

$5.710

10k+ parts

-

1,332

$8.850

$5.833

$5.710

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Arrow

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.833

10k+ parts

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8,500

-

-

$5.833

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.079

100+ parts

-

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50

$6.079

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-

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Digiode

USA . 3,237 parts In-Stock

1+ parts

$8.041

100+ parts

-

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3,237

$8.041

-

-

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Vyrian

USA . 4,466 parts In-Stock

1+ parts

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4,466

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Chip Stock

USA . 4,400 parts In-Stock

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4,400

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Distributors (Availability)

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Corohmni

South Africa . 110 parts In-Stock

1+ parts

$2.705

100+ parts

-

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-

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110

$2.705

-

-

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Parana Technologies

USA . 1,847 parts In-Stock

1+ parts

$4.562

100+ parts

-

1k+ parts

$5.012

10k+ parts

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1,847

$4.562

-

$5.012

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Semicontronic

India . 4,698 parts In-Stock

1+ parts

$4.960

100+ parts

$4.836

1k+ parts

$4.811

10k+ parts

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4,698

$4.960

$4.836

$4.811

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Ampacity Inc.

Singapore . 4,688 parts In-Stock

1+ parts

$4.960

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-

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4,688

$4.960

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DigiPath Technology Company

USA . 1,550 parts In-Stock

1+ parts

$5.023

100+ parts

$4.622

1k+ parts

-

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1,550

$5.023

$4.622

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ChromeModa Solutions

Germany . 5,147 parts In-Stock

1+ parts

$5.126

100+ parts

$4.203

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-

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5,147

$5.126

$4.203

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IDEA Electronic Components Group

UK . 1,583 parts In-Stock

1+ parts

$5.126

100+ parts

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$4.613

10k+ parts

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1,583

$5.126

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$4.613

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Continental Prestige Electronics

USA . 3,745 parts In-Stock

1+ parts

$6.079

100+ parts

-

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10k+ parts

$5.957

3,745

$6.079

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-

$5.957

Corphita

USA . 3,120 parts In-Stock

1+ parts

$7.618

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3,120

$7.618

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$10.038

100+ parts

$9.536

1k+ parts

$9.536

10k+ parts

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60

$10.038

$9.536

$9.536

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Lixinc

USA . 18,065 parts In-Stock

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18,065

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A-Z Elektronik GmbH

Germany . 2,434 parts In-Stock

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2,434

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Argo Parts USA

USA . 954 parts In-Stock

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954

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Futuretech Components

Singapore . 850 parts In-Stock

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850

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Overview

Discover the ISOW7741DFMR by Texas Instruments, a cutting-edge interface circuit that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts a wide range of applications in various industries. With its innovative design and advanced features, the ISOW7741DFMR provides customers with exceptional value, benefits, and advantages. Experience peace of mind knowing you have a top-of-the-line interface IC at your disposal for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for various environments and applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage ensures compatibility with a wide range of systems and devices, providing flexibility in design.

No. of Functions: 4

Having multiple functions in a single IC simplifies circuit design, reduces component count, and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB and ensures compatibility with standard board layouts.

No. of Terminals: 20

The high number of terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline, heat sink/slug, and shrink pitch package style offers thermal management capabilities and efficient space usage.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures compatibility with a variety of power sources and allows for energy-efficient operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range enables reliable performance in harsh environmental conditions and automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold temperatures, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and durability for long-term reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options, ensuring reliable performance in various scenarios.

Maximum Seated Height: 3.55 mm

The low maximum seated height allows for compact and slim designs, making it suitable for space-constrained applications.

Width: 7.5 mm

The moderate width of the IC facilitates easy integration into standard board layouts, ensuring compatibility with existing designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for efficient soldering processes during manufacturing, ensuring reliable connections.

Length: 12.83 mm

The moderate length of the IC offers a balance between functionality and space efficiency, making it suitable for various applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures reliable operation in automotive environments, meeting industry standards for quality and performance.

No. of Channels: 4

Having multiple channels allows for simultaneous data transmission and processing, enhancing the efficiency and performance of the interface IC.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections on the PCB, reducing the risk of connectivity issues and ensuring stable operation.

Nominal Supply Voltage: 3.3 V

The standard nominal supply voltage provides compatibility with common power sources and ensures consistent performance in various applications.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for fine pitch connections, optimizing PCB layout and ensuring efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate degree of sensitivity to moisture exposure, requiring standard handling and storage precautions.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type IC, it facilitates communication between different components and systems, enhancing overall system functionality and connectivity.

Technical Specifications

Other Function Interface ICs ISOW7741DFMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.83 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ISOW7741DFMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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