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ISO7731BDW

Texas Instruments

ISO7731BDW by Texas Instruments

ISO7731BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it offers 3 channels and features a small outline package style for surface mount assembly.

Median Price

$2.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,517 parts In-Stock

1+ parts

$2.554

100+ parts

$2.109

1k+ parts

$1.140

10k+ parts

-

3,517

$2.554

$2.109

$1.140

-

Mouser Electronics

USA . 3,182 parts In-Stock

1+ parts

$2.960

100+ parts

$1.950

1k+ parts

$1.610

10k+ parts

$1.480

3,182

$2.960

$1.950

$1.610

$1.480

DigiKey

USA . 8,186 parts In-Stock

1+ parts

$3.220

100+ parts

$2.131

1k+ parts

$1.773

10k+ parts

$1.685

8,186

$3.220

$2.131

$1.773

$1.685

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.710

-

-

-

Digiode

USA . 3,204 parts In-Stock

1+ parts

$2.033

100+ parts

-

1k+ parts

-

10k+ parts

-

3,204

$2.033

-

-

-

Chip Stock

USA . 27,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,280

-

-

-

-

Vyrian

USA . 4,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,652

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.676

100+ parts

-

1k+ parts

$1.609

10k+ parts

-

100

$1.676

-

$1.609

-

Continental Prestige Electronics

USA . 5,145 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

$1.676

5,145

$1.710

-

-

$1.676

Argo Parts USA

USA . 4,018 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

4,018

$1.710

-

-

-

Corphita

USA . 1,431 parts In-Stock

1+ parts

$1.926

100+ parts

-

1k+ parts

-

10k+ parts

-

1,431

$1.926

-

-

-

Ampacity Inc.

Singapore . 4,689 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

-

10k+ parts

-

4,689

$2.170

-

-

-

Semicontronic

India . 4,556 parts In-Stock

1+ parts

$2.170

100+ parts

$2.116

1k+ parts

$2.105

10k+ parts

-

4,556

$2.170

$2.116

$2.105

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$4.956

100+ parts

-

1k+ parts

$5.494

10k+ parts

-

2,100

$4.956

-

$5.494

-

ChromeModa Solutions

Germany . 2,962 parts In-Stock

1+ parts

$5.568

100+ parts

$4.566

1k+ parts

-

10k+ parts

-

2,962

$5.568

$4.566

-

-

IDEA Electronic Components Group

UK . 1,667 parts In-Stock

1+ parts

$5.568

100+ parts

-

1k+ parts

$5.011

10k+ parts

-

1,667

$5.568

-

$5.011

-

Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$6.869

100+ parts

$6.526

1k+ parts

$6.526

10k+ parts

-

95

$6.869

$6.526

$6.526

-

Corohmni

South Africa . 45 parts In-Stock

1+ parts

$12.418

100+ parts

-

1k+ parts

-

10k+ parts

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45

$12.418

-

-

-

Lixinc

USA . 15,584 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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15,584

-

-

-

-

DigiPath Technology Company

USA . 954 parts In-Stock

1+ parts

-

100+ parts

$5.020

1k+ parts

-

10k+ parts

-

954

-

$5.020

-

-

Overview

Discover the unparalleled quality and reliability of Texas Instruments with the ISO7731BDW interface circuit. This versatile product is perfect for a wide range of applications, offering customers a seamless and efficient solution for their needs. With its innovative technology and superior performance, this small outline IC provides maximum supply voltage of 5.5V and operates in extreme temperatures from -55°C to 125°C. Trust in Texas Instruments to deliver top-notch products that exceed expectations and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, ensuring long-lasting performance in various environments.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in power requirements.

Package Shape: RECTANGULAR

Allows for efficient use of space on the circuit board, ideal for compact designs.

No. of Terminals: 16

Provides multiple connection points for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for efficient PCB layout.

Minimum Supply Voltage: 2.25 V

Supports low voltage operation, ideal for energy-efficient applications.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, enhancing reliability and performance.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions, making it versatile for various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for enhanced signal integrity and stability.

Maximum Seated Height: 2.65 mm

Low profile design saves space and enables compact device designs.

Width: 7.5 mm

Narrow width allows for efficient use of board space, suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, complying with environmental regulations.

Length: 10.3 mm

Compact length facilitates easy integration into various electronic devices.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance in harsh environments.

No. of Channels: 3

Multiple channels enable versatile functionality and compatibility with various systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure mounting and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Nominal voltage level ensures stable operation and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration and compatibility with industry-standard PCB designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 ensures resistance to moisture and humidity, maintaining performance in challenging environments.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring reliable communication and data transfer.

Technical Specifications

Other Function Interface ICs ISO7731BDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7731BDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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