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ISO7641FMDW

Texas Instruments

ISO7641FMDW by Texas Instruments

ISO7641FMDW by Texas Instruments is a 4-channel interface IC with a supply voltage range of 2.7V to 5V. It has a small outline package style, dual terminal position, and operates in automotive temperature grades. Ideal for applications requiring high reliability and performance in harsh environments.

Median Price

$7.392

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,171 parts In-Stock

1+ parts

$6.915

100+ parts

$5.637

1k+ parts

$3.758

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33,171

$6.915

$5.637

$3.758

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Verical

USA . 134 parts In-Stock

1+ parts

$7.385

100+ parts

-

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134

$7.385

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Arrow

USA . 134 parts In-Stock

1+ parts

$10.806

100+ parts

$8.474

1k+ parts

$7.385

10k+ parts

-

134

$10.806

$8.474

$7.385

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Mouser Electronics

USA . 108 parts In-Stock

1+ parts

$13.120

100+ parts

$9.560

1k+ parts

$8.430

10k+ parts

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108

$13.120

$9.560

$8.430

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DigiKey

USA . 253 parts In-Stock

1+ parts

$13.450

100+ parts

$9.568

1k+ parts

$8.297

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253

$13.450

$9.568

$8.297

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Chip1Stop

Japan . 400 parts In-Stock

1+ parts

-

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$4.785

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$4.593

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400

-

$4.785

$4.593

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RS (Exports)

UK . 103 parts In-Stock

1+ parts

-

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$7.056

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103

-

$7.056

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Rochester

USA . 3 parts In-Stock

1+ parts

-

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$7.400

1k+ parts

$6.620

10k+ parts

$6.230

3

-

$7.400

$6.620

$6.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,951 parts In-Stock

1+ parts

$4.959

100+ parts

-

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2,951

$4.959

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-

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$5.637

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58

$5.637

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Chip Stock

USA . 24,500 parts In-Stock

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24,500

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Vyrian

USA . 4,670 parts In-Stock

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4,670

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Prism Electronics

USA . 103 parts In-Stock

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103

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A2Z Electronics, Inc.

USA . 62 parts In-Stock

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62

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Bristol Electronics

USA . 62 parts In-Stock

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62

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Sensible Micro Corp

USA . 61 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 35 parts In-Stock

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35

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LWI Electronics Inc

India . 18 parts In-Stock

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18

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Component Sense

UK . 8 parts In-Stock

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8

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AGACORP

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,055 parts In-Stock

1+ parts

$4.070

100+ parts

$3.968

1k+ parts

$3.948

10k+ parts

-

5,055

$4.070

$3.968

$3.948

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Ampacity Inc.

Singapore . 4,879 parts In-Stock

1+ parts

$4.070

100+ parts

-

1k+ parts

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4,879

$4.070

-

-

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Corphita

USA . 1,388 parts In-Stock

1+ parts

$4.698

100+ parts

-

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1,388

$4.698

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$5.524

100+ parts

-

1k+ parts

$5.303

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100

$5.524

-

$5.303

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Continental Prestige Electronics

USA . 2,979 parts In-Stock

1+ parts

$5.637

100+ parts

-

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-

10k+ parts

$5.524

2,979

$5.637

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-

$5.524

Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$5.951

100+ parts

-

1k+ parts

$6.732

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1,186

$5.951

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$6.732

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DigiPath Technology Company

USA . 25 parts In-Stock

1+ parts

$6.553

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25

$6.553

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.585

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$6.256

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$6.256

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2,000

$6.585

$6.256

$6.256

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

1+ parts

$6.687

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$6.018

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1,194

$6.687

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$6.018

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ChromeModa Solutions

Germany . 567 parts In-Stock

1+ parts

$6.687

100+ parts

$5.483

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567

$6.687

$5.483

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Corohmni

South Africa . 1,232 parts In-Stock

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$14.407

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1,232

$14.407

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Lixinc

USA . 5,541 parts In-Stock

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5,541

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Argo Parts USA

USA . 2,416 parts In-Stock

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2,416

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Infinite Electronics LLP (Excess)

. 1,243 parts In-Stock

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1,243

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Formix International (Excess)

India . 814 parts In-Stock

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814

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Overview

Discover the innovative ISO7641FMDW by Texas Instruments, a top-quality Other Function Interface IC that offers unmatched reliability and performance. With its surface mount design and small outline package style, this product is perfect for a variety of applications. Whether you're in the automotive industry or working on industrial equipment, this IC provides 4 functions with a wide supply voltage range and high operating temperature capabilities. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the ISO7641FMDW and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications while also reducing the overall weight of the device.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the IC onto a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 5 V

The high maximum supply voltage allows for versatile use in a wide range of systems without the risk of overloading the IC.

No. of Functions: 4

With multiple functions integrated into one IC, this product offers increased functionality and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to align and mount the IC onto a circuit board, simplifying the assembly process.

No. of Terminals: 16

Having a high number of terminals allows for more connections and interfaces, expanding the versatility of the IC in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making the product ideal for compact electronic devices.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the IC adaptable to different operating conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to withstand harsh environmental conditions, increasing its reliability and durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers corrosion resistance and reliability for the terminals, ensuring long-term performance of the IC in various operating conditions.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options on the circuit board, enhancing the ease of integration and assembly.

Maximum Seated Height: 2.65 mm

The low seated height saves space on the circuit board, making the IC suitable for thin and compact electronic devices.

Width: 7.5 mm

The compact width of the IC further contributes to its space-saving design, making it ideal for applications where board space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time allows for quick and efficient soldering of the IC to the circuit board, reducing assembly time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the IC to the circuit board, resulting in reliable connections and long-term performance.

Length: 10.3 mm

The compact length of the IC further contributes to its space-saving design, making it ideal for applications requiring a small footprint.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the IC can operate reliably in automotive applications, meeting industry standards for performance and durability.

No. of Channels: 4

Having multiple channels allows for simultaneous data transmission and processing, enhancing the efficiency and capability of the IC in complex systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of mounting on the circuit board, ensuring reliable performance and ease of assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable power source for the IC, ensuring consistent and reliable operation in various applications.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact layout designs on the circuit board, optimizing space utilization and integration efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the IC can withstand normal exposure to moisture during storage and assembly, ensuring long-term reliability in various environments.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components in an electronic system, enabling seamless integration and data exchange.

Technical Specifications

Other Function Interface ICs ISO7641FMDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5 V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7641FMDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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