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ISO7221CDRG4

Texas Instruments

ISO7221CDRG4 by Texas Instruments

ISO7221CDRG4 by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 2.8V to 5V and small outline package style, it's ideal for various function interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 32,960 parts In-Stock

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32,960

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Vyrian

USA . 5,725 parts In-Stock

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5,725

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Digiode

USA . 2,305 parts In-Stock

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2,305

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$7.544

100+ parts

$7.167

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$7.167

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-

3,000

$7.544

$7.167

$7.167

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Parana Technologies

USA . 620 parts In-Stock

1+ parts

$7.891

100+ parts

-

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$8.446

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620

$7.891

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$8.446

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Corohmni

South Africa . 25 parts In-Stock

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$8.344

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25

$8.344

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DigiPath Technology Company

USA . 2,142 parts In-Stock

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$8.689

100+ parts

$7.994

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$8.689

$7.994

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ChromeModa Solutions

Germany . 6,090 parts In-Stock

1+ parts

$8.866

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$7.270

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$8.866

$7.270

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IDEA Electronic Components Group

UK . 347 parts In-Stock

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$8.866

100+ parts

$8.423

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$7.979

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347

$8.866

$8.423

$7.979

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AZTECH Wire

Italy . 843 parts In-Stock

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$17.385

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$17.385

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Ampacity Inc.

Singapore . 233 parts In-Stock

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$17.500

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One Stop Electronics

USA . 754 parts In-Stock

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$46.500

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$46.500

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Semicontronic

India . 258 parts In-Stock

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$47.500

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$46.312

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$46.075

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258

$47.500

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Argo Parts USA

USA . 4,265 parts In-Stock

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Continental Prestige Electronics

USA . 3,730 parts In-Stock

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Corphita

USA . 2,290 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7221CDRG4, an Interface IC designed to meet the demands of various applications. With a wide supply voltage range and automotive-grade temperature rating, this small outline package offers dual-channel functionality for seamless integration. Trust in Texas Instruments' advanced CMOS technology and nickel palladium gold terminal finish to deliver exceptional performance and durability. Elevate your projects with the ISO7221CDRG4 and unlock a new level of precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and space in the manufacturing process.

Maximum Supply Voltage: 5 V

Support for a maximum supply voltage of 5V ensures compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration and placement on PCBs, optimizing space utilization.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and functions in the circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact design of electronic systems.

Minimum Supply Voltage: 2.8 V

Support for a minimum supply voltage of 2.8V ensures efficient power usage and performance in low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable operation in harsh environments and industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables the IC to function in extreme cold conditions without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and ease of connection in the circuit layout.

Maximum Seated Height: 1.75 mm

Low maximum seated height of 1.75mm minimizes the profile of the IC, ideal for compact electronic designs.

Width: 3.895 mm

Narrow width of 3.895mm enables efficient placement and routing on the PCB, optimizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the IC can withstand the soldering process effectively without damage.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints and assembly during manufacturing processes.

Length: 4.905 mm

Compact length of 4.905mm contributes to the overall small footprint of the IC, ideal for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates the IC's ability to withstand high temperature fluctuations, making it suitable for automotive applications.

No. of Channels: 2

Having 2 channels allows for multiple input/output communication paths, enhancing the functionality and versatility of the IC.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various operating voltages, making it an efficient choice for the IC.

Terminal Form: GULL WING

Gull wing terminal form enables secure mounting and reliable connection to the PCB, ensuring stable performance in demanding conditions.

Nominal Supply Voltage: 5 V

Support for a nominal supply voltage of 5V ensures stable operation and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the IC allows for precise and compact placement on the PCB, facilitating efficient circuit design.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type, the IC enables seamless communication between different components or systems, enhancing overall system functionality.

Technical Specifications

Other Function Interface ICs ISO7221CDRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7221CDRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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